共搜索到4572条信息,每页显示10条信息,共458页。用时:0小时0分1秒80毫秒
B. Ink-jet printing of wax-based alumina suspension[J]. Journal of the American Ceramic Society, 2001, 84(11): 2514-2520. [50] BHOLA R, CHANDRA S. Parameters controlling solidification of molten wax......
structure [15]. That is, upon drying the mud solidifies and shrinks causing cracks and macropores to form to depth in the residue deposit [16]. Solidification occurs because pozzolanic materials present......
J. Cent. South Univ. (2019) 26: 3066-3086 DOI: https://doi.org/10.1007/s11771-019-4237-x Enhancing performance of soil using lime and precluding landslide in Benin (West Africa) Quirin Engelbert Ayeditan ALAYE1, LING Xian-zhang1, Yvette Sèdjro KIKI TANKPINOU2,Marx Ferdinand AHLINHAN2, LUO Jun1, Mi......
J. Cent. South Univ. (2020) 27: 3417-3435 DOI: https://doi.org/10.1007/s11771-020-4556-y Effects of curing under step-by-step load on mechanical and deformation properties of cemented gangue backfill column GUO Yu-xia(郭育霞)1, 2, RAN Hong-yu(冉洪宇)1, 2, FENG Guo-rui(冯国瑞)1, 2, DU Xian-jie(杜献杰)1, 2, QI ......
] and extrusion [2], available SPD approaches include high-pressure torsion (HPT) [3], equal channel angular pressing (ECAP) [4], multi-directional forging (MDF) [5], accumulative roll bonding (ARB..., solidified at a solidification rate of 390 K/s, and deformed along the groove of Castex wheel with circulated cooling water in the interior. Then, the solid alloy was forced to turn 90° at the abutment......
simulations of continuously graded aluminum foams prepared by the direct foaming route coupled with the solidification process. They demonstrated that the lower TiH2 content of foaming agent and shorter......
solidification, the build platform descends, the following powder is spread on the first layer, and the process is repeated to complete the part. Figure 1 shows a schematic diagram of the 3DP process [6......
joints based on creep model[J]. Journal of Mechanical Engineering, 2009, 45(9): 279-284. [144] Yu H, Shangguan D K. Solidification and reliability of lead-free solder interconnection[J]. Soldering......
are not recommended because of the solidification and liquefaction cracking and also the tendency to form large hard and brittle IMCs consequently the weld defects [4]. Solid state welding of Al to Cu could avoid......
high-entropy alloy by Bridgman solidification[J]. Intermetallics, 2014, 54: 104-109. [87] DAOUD H M, MANZONI A, V LKL R, WANDERKA N, GLATZEL U. Microstructure and tensile behavior......