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interfacial charge transfer [J]. Nano Letters, 2011, 11: 4774-4779. [23] LIU C, YANG D, JIAO Y, TIAN Y, WANG Y, JIANG Z. Biomimetic synthesis of TiO2-SiO2-Ag nanocomposites with enhanced visible......
in the solid/liquid interfacial energy, leading to a decrease in the nucleation rate, and 3) a necessity for the long-range diffusion of atoms, leading to a decrease in the growth of crystalline phases [15,16......
)与40Cr的界面行为与接头强度[J]. 焊接学报, 2014, 35(5): 5-8. WU Ming-fang, KUANG Hong-jin, WANG Fei, XU Guo-xiang. Interfacial behavior and joint strength of Ti (C, N) and 40Cr joints obtained by liquid-solid......
and Technology, 2013, 2: 75-86. [7] CHU Di, ZHANG Jian-yu, YAO Jin-jin, HAN Yan-qiu, WU Chun-jing. Cu-Al interfacial compounds and formation mechanism of copper cladding aluminum composites [J]. Transactions......
agglomerate-scale heap bioleaching system[J]. Biochemical Engineering Journal, 2015, 95: 86-97. [30] SAND W, GEHRKE T. Extracellular polymeric substances mediate bioleaching/biocorrosion via interfacial......
-ping, QI Zhen-ya, XU Mian-guang. Numerical simulation of flow and interfacial behavior in three-phase argon-stirred ladles with one plug and dual plugs[J]. Steel Research International, 2011, 82(4......
Trans. Nonferrous Met. Soc. China 29(2019) 165-177 Numerical simulation of hydrothermal mineralization associated with simplified chemical reactions in Kaerqueka polymetallic deposit, Qinghai, China Yan-hong ZOU1,2, Yao LIU1,3, Yong PAN4, Kuan-da YANG1,2, Ta-gen DAI1,2, Xian-cheng MAO1,2, Jian-qing ......
, 47: 83-87. [9] CHENG L, HIBBARD G D. Abnormal grain growth via the migration of planar growth interfaces [J]. Mater Sci Eng A, 2008, 492: 128-133. [10] HIBBARD G D, AUST K T, ERB U. On interfacial......
, interfacial flocculation and the generation of secondary pollution, which have an unavoidable effect on the extraction [9]. Although ion exchange was usually employed for the copper removal......
of Ni-coated carbon nanotubes on interfacial reaction and shear strength of Sn-Ag-Cu solder joints [J]. Journal of Electronic Materials, 2012, 41: 2478-2486. [24] HAKIMIZAD A, RAEISSI K, ASHRAFIZADEH......