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Influence of External Interface Normal Stress on the Growth of Cu–Sn IMC During AgingChangchang Wang1,2,Yinbo Chen1,2,Zhi-Quan Liu1,2,31. Institute of Metal Research,Chinese Academy of Sciences2... behavior of Cu–Sn intermetallic compound(IMC) during thermal aging at 150 °C was investigated. The results show that compared with the sample at general stress-free state, the growth rate of IMC under......
Sn3.0Ag0.5Cu0.05Cr/Cu焊点界面IMC层热时效形貌及生长行为研究谢仕芳1,韦习成2,鞠国魁2,徐可心21. 江西省科学院应用物理研究所2. 上海大学摘 要:研究了Sn3.0Ag0.5Cu0.05Cr焊料(SACCr)制成的Cu/Solder/Cu焊点在150℃时效0,168,500及1000 h下界面金属间化合物(IMC)层的形貌及生长行为,并与Sn3.0Ag0.5Cu(SAC)焊料的焊点进行了比较.结果表明,相对于SAC的焊点,SACCr中弥散或固溶分布的微量Cr延缓了焊点界面IMC层的生长.时效时间越长,Cr的阻抑效果越明显.150℃时效1000 h的Cu/SACCr/Cu焊点界面IMC层的平均厚度是Cu/SAC/Cu的45%,仅为5.13μm.关键词:SnAgCu......
Sn-Zn钎料/Cu基板焊点界面元素扩散与IMC形成热力学分析赵国际,盛光敏,吴莉莉重庆大学摘 要:对270℃条件下Sn-Zn钎料/Cu基板焊点界面反应进行了热力学计算与分析,并利用SEM,EDS,XRD及显微硬度计对焊点界面进行了检测与分析.结果表明:界面Cu基板侧金属间化合物(IMC)CuZn层的形成是自发的,钎料侧形成的CuZn持续与扩散过来的Zn原子反应生成Cu5Zn8;Cu原子越过界面IMC层向钎料中的扩散与聚集呈现"脉动"形式,在临近结合面的钎料中形成粒状Cu5Zn8 IMC,并造成靠近界面区钎料中的Zn元素含量呈现间隔的"减少-聚集"现象;界面IMC层未造成焊点界面硬度突变.关键词:Sn-Zn钎料;界面;元素扩散;IMC;热力学;......
J. Cent. South Univ. (2016) 23: 581-597 DOI: 10.1007/s11771-016-3105-1 IMC based robust pid controller tuning for disturbance rejection Mohammad Shamsuzzoha Department of Chemical Engineering, King Fahd University of Petroleum and Minerals, Dhahran 31261, Saudi Arabia Central South University Press and Springer-Verlag Berlin Heidelberg 2016 Abstract: It is well-known that the IMC-PID......
BGA结构Sn-3.0Ag-0.5Cu/Cu焊点低温回流时界面反应和IMC生长行为周敏波,马骁,张新平华南理工大学材料科学与工程学院摘 要:采用差示扫描量热法将焊点的熔化行为表征与焊点回流焊工艺相结合,研究了球栅阵列(BGA)结构单界面Sn-3.0Ag-0.5Cu/Cu微焊点在钎料熔化温度附近等温时效形成局部熔化焊点时的界面反应及界面金属间化合物(IMC)的生长行为.结果表明,在钎料熔点217℃时效时,焊点中钎料基体仅发生界面局部熔化;而在稍高于熔点的218℃时效时,焊点钎料基体中全部共晶相和部分-Sn相发生熔化,且Cu基底层的消耗量显著增大,绝大部分Cu基底直接溶蚀进入钎料基体并导致界面IMC净生长厚度相对217℃时效时减小;等温时效温度升高至230℃时,焊点中钎料基体全部熔化,界面IMC厚度达到最......
. SMIT Center, Chalmers University of Technology, 412-96 G?teborg, Sweden) 摘 要:研究了Cu/Sn-3.0Ag-0.5Cu/Cu焊点在(150±1)℃时效温度下,0~1 000 h不同时间时效后焊点的拉伸断裂性能以及界面金属间化合物(IMC)的组织形态和成分.结果表明:随着时效时间的延长,焊点拉伸强度降低,拉伸断裂主要发生于Solder/IMC界面或/和IMC/IMC界面,而且断口形貌逐渐由韧窝状断口为主向解理型脆性断口转变.SEM研究发现,时效过程中界面IMC不断长大,增厚并呈针状或块状从Cu/Solder界面向焊点心部生长,时效1 000 h的焊点中IMC分层明显.半焊点结构为Cu/Cu3Sn/Cu6Sn5/Solder,同时,在靠近铜基体的IMC中有Kirkendall空洞存在. 关键词:金属间化合......
Finite element analysis on stresses field of normalized layer thickness within ceramic coating on aluminized steel WU Zhen-qiang(吴振强), XIA Yuan(夏 原), LI Guang(李 光), XU Fang-tao(徐方涛) Institute... dipping aluminum(HDA) and plasma electrolytic oxidation(PEO). A triangle of normalized layer thickness was created for describing thickness ratios of HDA/PEO coatings. Then, the effect of thickness......
J. Cent. South Univ. (2016) 23: 2346-2353 DOI: 10.1007/s11771-016-3293-8 Minimum safe thickness of rock plug in karst tunnel according to upper bound theorem YANG Zi-han(杨子汉), ZHANG Jia-hua(张佳华... ahead of a karst tunnel face tend to cause geological disasters, such as water and mud bursts. So, the determination of safe thickness of the reserved rock plug is a key technical problem to be solved......
J. Cent. South Univ. (2019) 26: 955-969 DOI: https://doi.org/10.1007/s11771-019-4063-1 An attribute recognition model for safe thickness assessment between concealed karst cave and tunnel HUANG Xin... model for safe thickness assessment between a concealed karst cave and a tunnel is established based on the attribute mathematic theory. The model can be applied to carrying out risk classification......
:利用SP009A型半自动非金属系制造器,通过铜制单辊快淬工艺制得快速凝固态Sn2.5Ag0.7Cu钎料合金薄带,采用JSM-5610LV 扫描电镜及能谱仪,研究快速凝固态钎料合金的微观形貌及金属间化合物(IMC)特征;通过钎焊接头组织与剪切断口分析,研究IMC对钎焊接头韧性的影响机制.结果表明:快速凝固态钎料合金焊点界面处形成的排列紧密的小尺寸β-Sn能有效抑制界面处IMC Cu6Sn5的长大;在... with SP009A semi-automatic nonmetal series fabricate machine, and the micro-morphology and properties of intermetallic compound (IMC) were studied by JSM-5610LV scanning electronic microscope and energy......