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Relaxation process and phase transition of lanthanide liquid crystalline complexes by photoacoustic spectroscopy ZHANG Zhongning1,YANG Yuetao1,LIU Xiaojun1,LI Junjia1,ZHANG Shuyi1 (1.Key Laboratory of Modern Acoustics, Ministry of Education, Institute of Acoustics, Nanjing University, Nanjing 210093, China) Abstract:Lanthanide-containing liquid crystals exhibiting smectic A phase close to room......
together by ultrasonic energy and heat under certain pressure. A typical ultrasonic wire bonding system shown in Fig.1 consists of a phase locked loop ultrasonic generator, a piezoelectric driver, a barrel... Temperature effect in thermosonic wire bonding WU Yun-xin(吴运新), LONG Zhi-li(隆志力), HAN Lei(韩 雷), ZHONG Jue(钟 掘) School of Electromechanical Engineering, Central South University, Changsha 410083......
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found in materials grown by bulk method[6], liquid phase epitaxy (LPE)[7], MBE[8], and MOCVD[9], with incorporation as a p-type dopant under Hg-rich conditions, and as an n-type dopant or un-active... A, Devaney C M. Electrical activity, mode of incorporation and distribution coefficient of group V elements in Hg/sub 1-x/Cd/sub x/Te grown from tellurium rich liquid phase epitaxial growth solutions [J]. J......
are different. In particular, the bonding of advanced materials is not possible by classical welding methods because of unexpected phase propagation at the bond interface[2]. Hence, diffusion bonding introduces convenience to the bonding of dissimilar materials which are not possible to bond by conventional welding methods and it is preferred by the materials in which the formation of brittle phase......
, including diffusion bonding[1], oxynitride glasses joining[2], anodic bonding[3], joining via functional gradients[4], brazing[5-7], microwave bonding[8]and partial transient liquid phase bonding[9, 10... functional gradients were developed and studied later and used for limited material systems. Partial transient liquid phase bonding is a promising technique to obtain thermal resistance ceramic joint at lower......
Influence of the Substrate Orientation on the Isothermal Solidification during TLP Bonding Single Crystal SuperalloysNaicheng Sheng,Bo Li,Jide Liu,Tao Jin,Xiaofeng Sun,Zhuangqi HuSuperalloys Division, Institute of Metal Research, Chinese Academy of Sciences摘 要:Angle deviations between the two substrates during transient liquid phase(TLP) bonding single......
% for 10 h on aging. 3.2 Intermediate phase and diffusion bonding in Cu/Al interfaces Figure 2 shows the results of the EDX analyses for bonding layer formed at the interface of a drawn Cu/Al bar clad...-Cu binary phase diagram [12]. The thicknesses of diffusion layers formed at bonding interface increased and the intermetallic phases in diffusion layers were changed from (α+θ) phase to η2, (θ+η2), (α......
with increasing the holding time. Key words: AZ31B/Cu dissimilar metals; transient liquid-phase bonding; microstructure; properties 镁及镁合金具有密度低,比强度和比模量高,散热性和阻尼性好,电磁屏蔽能力强,尺寸稳定性好,易切削加工,储量丰富以及可循环利用等优点,成为现代工业产品的理想结构材料..., HUANG Wei-dong. Transient liquid phase bonding of magnesium alloy (AZ31B) and titanium alloy (Ti6Al4V) using aluminum interlayer[J]. Rare Metal Materials and Engineering, 2006, 35(10): 1677-1680. [18......
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