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. The interface of the joint produced at 255 ℃ with various soldering times was analyzed by scanning electron microscope (SEM), X-ray energy dispersive spectrometer (EDS) and X-ray diffraction (XRD). The results show that CuZn IMC forms preferentially within the Cu substrate. The Cu5Zn8 IMC forms by the reaction of CuZn with Zn atoms diffused from the solder. The effect of the soldering time......
of minor Nd. However, adding 0.5% Nd into Sn-9Zn alloy leads to the formation of large "cross" shaped NdSn3 intermetallic compound (IMC). Under the conditions of lower soldering temperature or shorter soldering time, the addition of trace Nd in Sn-9Zn could improve the spreading properties. With the increase of soldering temperature or soldering time, the spreading property of Sn-Zn-Nd alloy......
was investigated under the condition of extended soldering time. The results show that the Cu-Zn phases, which are composed of Cu5Zn8 and CuZn or Cu5Zn8, are formed at the interfaces of both Sn-9Zn/Cu-particles... solder greatly reduces the thickness of IMCs layer of Sn-9Zn/Cu-substrate. The reliability for Sn-9Zn/Cu joint is improved for the diminished Zn content in soldering joint due to the in-situ formation......
410083, China Received 28 April 2016; accepted 30 December 2016 Abstract: The AuSn20/Ni joints were prepared by the reflow soldering technology and then annealed at solid-state temperature to form diffusion couples. The interfacial reactions and the growth kinetics of the intermetallic compounds (IMC) at the AuSn20/Ni soldering interface were investigated by scanning electron microscopy (SEM......
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Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi/Cu lead-free solder jointsGuo-qiang Wei,Lei Wang,Xin-qiang Peng,Ming-yang XueSchool of Mechanical and Automotive Engineering, South China University of Technology摘 要:The ......
for surface mount com-ponent with the addition of 0.1% rare earth at soldering temperature of 250℃, preheating time of 15s and soldering time of 5s, i.e. it has higher wetting force and smaller wetting...℃时可充分发挥钎剂的作用而呈现最佳的润湿效果. 此时的F也远大于工业自动化钎焊的基本要求. 图4 润湿力随钎焊温度的变化曲线 Fig.4 Change curve of wetting force with soldering temperature 2.2.3 浸渍时间 图5所示为润湿力随浸渍时间的变化曲线. 由图5可见, 随浸渍时间延长, 钎......
; 凸点; 无铅钎料; 重熔; 金属间化合物 中图分类号: TG111 文献标识码: A Interface reaction of solder droplet/pad and intermetallic compounds evolution during reflow soldering LI Fu-quan, WANG Chun-qing, TIAN Yan-hong, KONG... were investigated by droplet direct laser fabrication method, which is compared with the interface structures for bump and pad under laser reflow bumping. The intermetallics evolution at solder bump/pad......
scanning electronic microscope and energy spectrum analysis. The results show that the Cu6Sn5 thickness of the solder joint interface is decided by its diffraction and growing during the soldering... during the soldering and aging period, and the crack initiation place can be changed, so the reliability of the solder joint can be greatly improved. Key words: Sn-2.5Ag-0.7Cu(0.1 RE) solder alloy......
effectively suppressed. With the addition of 0.7% Zn, ultimate tensile strengths (UTSs) of the Sn-58Bi solder slabs were respectively increased by 6.05% and 5.50% after reflow soldering and liquid-state aging... was significantly improved compared with that of the eutectic Sn-58Bi solder after reflow soldering and liquid-state aging. Key words: Zn; Sn-Bi solder; liquid-state aging; reflow soldering; creep 1......