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J. Cent. South Univ. (2021) 28: 39-47 DOI: https://doi.org/10.1007/s11771-021-4584-2 Stacking fault energy and electronic structure of molybdenum under solid solution softening/hardening LIU Pan(刘攀.... On the contrary, the elements of W, Ta, Ti, and Nb could bring about the solid-solution hardening of Mo through the impediment of the slip of the dislocation and the decrease of ductility. Electronic structures......
Structural,electronic and elastic properties of YCu from first principles S.U1,G.U1,R.Ellialtio2,F.Soyalp3,M.4 (1.g)ur(g;2.g)lu(g;3.Department of Physics,Yuzuncu Yd University,Zeve Kampusu,Van,65080 Turkey;4.C)ivi(g) Abstract:The structural,electronic and elastic properties of YCu compound in the B2 (CsC1) phase were investigated using the density functional theory (DFT) within the generalized......
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First principles study on electronic structure and optical properties of novel Na-hP4 high pressure phase SHI Yi-min(施毅敏)1, YE Shao-long(叶绍龙)2 1. Department of Basic Teaching, Hunan... Abstract: The electronic structure and optical properties of novel Na-hP4 high pressure phase at different pressures (260, 320, 400 and 600 GPa) were investigated by the density functional theory (DFT......
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Rare earth doped CaCu_3Ti_4O_(12) electronic ceramics for high frequency applications LIU Yingli1,MU Chunhong1,SONG Yuanqiang1,LIU Peng2,ZHANG Huaiwu1 (1.State Key Laboratory of Electronic Thin Films and Integrated Devices,University of Electronic Science and Technology of China,Chengdu 610054,China;2.School of Physics and Information Technology,Shaanxi Normal University,Xi′an 710062,China......
First principles calculation on electronic structure, chemical bonding, elastic and optical properties of novel tungsten triborideWANG Yi-fu(王一夫)1, XIA Qing-lin(夏庆林)2, YU Yan(余燕)2(1. Key Laboratory.... School of Physics and Electronics, Central South University, Changsha 410083, China)Abstract:The electronic structures, chemical bonding, elastic and optical properties of the novel hP24 phase WB3 were......
for electronic applications by spray forming process in Osprey Metals Ltd.[7-8]. These alloys have been produced in large and applied in RF Packages & Microwave Packages, Carrier Plates for High... to the diffusion of atoms during densification process. Key words: Si-30%Al alloy; spray forming; electronic packaging materials; microstructures variation; densification process 1 Introduction A new......