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Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applicationsZHANG Ximin,GUO Hong,YIN Fazhang,FAN Yeming,and ZHANG Yongzhong National Engineering Research Center for Nonferrous Metals Composites,General Research Institute for Non-ferrous Metals,Beijing 100088,China摘 要:Diamond/Cu-xCr composites were......
with activation energy of 70.0 kJ/mol. Key words: electroplation; electronic packaging materials; interfacial reaction; reaction kinetics ...究[J]. 电子与封装, 2007, 7(3): 4-6, 33.HAN Yong-dian, JING Hong-yang, XU Lian-yong, GUO Wei-jie, WANG Zhong-xing. Study on the reliability of Sn-Ag-Cu lead-free solders[J]. Electronics & Packaging, 2007......
;INTRODUCTION As a traditional alloy, Au-Cu system is extensively applied in catalysis, electronic industry and biological material field. Recently, some new functions of the alloy are found in nano-crystal...Electronic structure of Au-Cu alloys YU Fang-xin(余方新), XIE You-qing(谢佑卿), NIE Yao-zhuang(聂耀庄), LI Xiao-bo(李小波), PENG Hong-jian(彭红键), TAO Hui-jin(陶辉锦) (School of Materials Science and Engineering......
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and Engineering, Central South University, Changsha 410083, China) Abstract: In order to fabricate high–silicon aluminum alloy electronic packaging materials, the oxidating processes in high temperature...% and 23.5%, and the compression strength of Al-30Si and Al-40Si decreases by 26.8% and 20.5%, respectively. Key word: high-silicon aluminum alloy; electronic packaging; rapid solidification; oxidated......
封装材料; 液相烧结; 压制压力; 热导率 中图分类号:TF124.5 文献标识码:A 文章编号: 1672-7207(2005)02-0198-06 Effect of Pressing Pressure on Properties of Si-Al Electronic Packaging Materials FENG Xi1,YANG Ying-xin2,ZHENG..., Jiangxi University of Science and Technology, Nanchang 330013, China) Abstract: Si-50%Al electronic packaging materials were fabricated by liquid phase sintering. The effects of pressing pressure......
of thermal expansion is just 9.6×10?6/K. Key words: 70%Si-Al alloy; electronic packaging; thermal conductivity; spray deposition ...封装材料[J]. 材料导报, 2002, 16(9): 1?4. ZHANG Ji-shan. New spray formed light weighted Si-Al electronic packaging materials with low thermal expansion and high heat conducting[J]. Materials Review, 2002, 16......
alloy particles is not obvious, but that of Al-30Si hypereutectic alloy is very obvious. Key words: high-silicon aluminum alloy; electronic packaging; high temperature atmosphere oxidation ...-silicon aluminum alloy material, eutectic Al-12Si and hypereutectic Al-30Si alloy powders were pretreated in high temperature atmosphere oxidation, then they were canned and extruded into Al alloy......
Study on Graphene Oxide Modified Inorganic Phase Change Materials and Their Packaging Behavior肖力光,ZHAO Mingyue,HU HongliangSchool of Materials Science and Engineering, Jilin Jianzhu University摘 要...·12H2O was 8:2 and the weight ratio of graphene oxide was 0.5% of phase change material, the phase change "alloy" material showed excellent performances, specifically, the melting temperature and latent......
density [1,2]. High silicon aluminum-based electronic packaging materials have advantages of high thermal conductivity, low CTE, low density, easy machining, etc, becoming an ideal material for high... the box material and other materials commonly used for electronic packaging. As shown in Table 3, Al-Si alloy with high Si content has low CTE near to that of BeO and GaAs, its thermal conductivity is five......
