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with bonding time 3.3 Bonding mechanisms The DB process of metal and/or alloy is generally attributed to several mechanisms as follows [13,19]: 1) plastic deformation; 2) diffusion mechanism, including...Trans. Nonferrous Met. Soc. China 25(2015) 80-87 Bonding interface characteristic and shear strength of diffusion bonded Ti-17 titanium alloy Hong LI, Chao ZHANG, Hong-bin LIU, Miao-quan LI School......
of the bonding of interface but the result of interface high pressure. So the diffusion welding cannot also explain the bonding mechanism of it. The experiment and theory make clear that explosive welding..., Nanjing 210007, China) Abstract:There are four new achievements of this work on the theory and technology of explosive welding.(1) It has been found and defined three kinds of bonding interfaces: big......
; 刚. 铜/铝复合材料的固-液复合法制备及其界面结合机理[J]. 中国有色金属学报, 2008, 18(3): 414-420. ZHANG Hong-an, CHEN Gang. Fabrication of Cu/Al compound materials by solid-liquid bonding method and interface bonding mechanism[J.../copper bimetal plate[J]. Materials Transaction, 2006, 47(4): 1232-1239. Thermal-flow coupled numerical simulation and experimental research on bonding mechanism of Cu/Al composite strip by solid......
): 1019-1025. [20] Huang Hua-gui, Ji Ce, Dong Yi-kang, DU Feng-shan. Thermal-flow coupled numerical simulation and experimental research on bonding mechanism of Cu/Al composite strip by solid-liquid cast...Trans. Nonferrous Met. Soc. China 28(2018) 2460-2469 Bonding strength of Invar/Cu clad strips fabricated by twin-roll casting process Peng CHEN1,2, Hua-gui HUANG1,2, Ce JI1,2, Xu ZHANG1,2, Zhong-hua......
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was reviewed. The review mainly includes the fabrication of copper cladding aluminum bimetallic composites, the bonding mechanism of Cu/Al interface, the Cu-Al binary alloy phase diagram, and the formation and growth rule of intermetallic compounds. Finally, the development trend was proposed. Key words: copper cladding aluminum; composite; bonding mechanism; interfacial reaction 世界上铜资源的匮乏和市场价格较高,促......
Building metallurgical bonding interfaces in an immiscible Mo/Cu system by irradiation damage alloying (IDA)Jinlong Du,Yuan Huang,Chan Xiao,Yongchang LiuTianjin Key Laboratory of Composite...), building metallurgical bonding interfaces directly between immiscible Mo and Cu and preparing Mo/Cu laminar metal matrix composites(LMMCs) are very difficult. To solve the problem, a new alloying......
The Frame and Function Analysis of the Non-Crystal Bonding Brushing Plating Ni-W-SiC Coat XIANG wei-xiang1,ZHANG Yu-feng1,CAO Shou-liang1 (1.Wuhan Ordnance Noncommissioned Officer School, Wuhan 430075, China) 摘要:The article discusses the electric brushing plating technology of the Ni-W-SiC non-crystal bonding coat.By the brushing plating technology it attains the non-crystal bonding coat which......
Bonding Energy and Growth Habit of Lithium Niobate Single Crystals Xue Dongfeng1,Zhang Xu1 (1.State Key Laboratory of Fine Chemicals, Department of Materials Science and Chemical Engineering, School of Chemical Engineering, Dalian University of Technology, Dalian 116012, China) Abstract:On the basis of crystallographic structure of lithium niobate (LN), the bonding energy was quantitatively......
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