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高能球磨制备金锡合金钎料 李才巨1,陶静梅1,徐孟春1,朱心昆1 (1.昆明理工大学,材料与冶金工程学院,昆明,650093) 摘要:采用高能球磨法制备金锡共晶合金钎料,研究球磨后样品的微观组织随球磨时间的演变规律.XRD的检测结果表明,随着球磨时间的延长,球磨后的样品中依次出现ε相(AuSn_2),δ相(AuSn)和ζ相(Au_5Sn)等金属间化合物,出现顺序与合金化程度密切相关.SEM及EDX的观察结果表明,随着球磨时间的延长,单质Au粉与Sn粉之间实现了充分的合金化,标志粉末处于焊合过程中的河流状变形带的密度逐渐降低,最后趋于消失,组织整体均匀性提高,获得了成分均匀的共晶合金. 关键词:金属材料; 金锡合金; 钎料; 高能球磨; 机械合金化; 金属间化合物; metal material; Au-Sn alloy; solder; high energy ball......
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Ni(OH)2 particles synthesized by high energy ball milling LIU Yuan-gang(刘元刚), TANG Zhi-yuan(唐致远), XU Qiang(徐 强), ZHANG Xiao-yang(张晓阳), LIU Yong(柳 勇) School of Chemical Engineering and Technology, Tianjin University, Tianjin 300072, China Received 17 October 2005; accepted 6 March 2006 Abstract: High energy ball milling(HEBM) method was applied to synthesize nickel hydroxide......
Characterization of Cu3P phase in Sn3.0Ag0.5Cu0.5P/Cu solder jointsJian-xun Chen,Xing-ke Zhao,Xu-chen Zou,Ji-hua Huang,Hai-chun Hu,Hai-lian LuoSchool of Materials Science and Engineering,University... of Sn3.0Ag0.5Cu solder.The melting behavior of the solder alloys was determined by differential scanning calorimetry.The interfacial microstructure and phase composition of solder/Cu joints were......
J. Cent. South Univ. Technol. (2008) 15: 313-317 DOI: 10.1007/s11771-008-0059-y Effect of adding Ce on interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu substrate LU Bin(卢 斌), LI Hui(栗... compound (IMC) layer at the interface between Sn-3.0Ag-0.5Cu- xCe solder and Cu substrate during soldering and aging were studied. The results show that Cu6Sn5 IMC is observed at the interface......
℃. Key words: lead-free solder; Sn-Ag-Cu-Ce alloy; wetting time; solidus; liquidus CLC number: TG146.1 ... Article ID: 1003-6326(2005)06-1285-05 Effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder XUE Song-bai(薛松柏)1, YU Sheng-lin(禹胜林)2, WANG Xu-yan(王旭艳)1, LIU......
EVOLUTION OF MICROSTRUCTURE OF Sn-Ag-Cu LEAD-FREE FLIP CHIP SOLDER JOINTS DURING AGING PROCESS C.Q. Wang1,Y.H. Tian1,W.F. Zhou1 (1.State Key Lab of Advanced Welding Production and Technology,Harbin... manufacturing industry in recent years. The solder joints of the flip chip bonding are small and consist of complicated microstructures such as Sn solution,eutectic mixture, and intermetallic compounds (IMCs......
respectively were prepared by ball milling. The crystallite size and morphology of the as-milled powders were characterized and their hydrolysis behaviours were investigated in comparison with commercial... for 80min achieving about 76% and 62% respectively. However, the addition of Al doesnt show any positive effect on the improvement of the hydrolysis kinetics of MgH2. Key words: ball milling......
on the mechanical properties of a nanostructured Al-10wt.%Cu alloy was investigated. Stress-strain microprobe system (SSM) and its automated ball indentation (ABI) test were used for evaluating the mechanical properties of this alloy. The tests were conducted at 21 °C on the bulk samples that were mechanically alloyed for 6 h at two ball-to-powder mass ratios (BPR) of 30:1 and 90:1. Furthermore......
Shear Deformation Behaviors of Sn3.5Ag Lead-free Solder SamplesJing Han1,Hongtao Chen1,Mingyu Li1,2,Chunqing Wang21. Department of Materials Science and Engineering,Shenzhen Graduate School,Harbin... have been performed on the as-reflowed Sn3.5Ag solder bumps and joints to investigate the deformation behavior of Sn3.5Ag lead-free solder samples.Scanning electron microscopy(SEM) was employed......
