共搜索到16915条信息，每页显示10条信息，共1692页。用时：0小时0分0秒375毫秒
......
Ultrasonic characterization of modified Cr2O3 coatings by reflection coefficient spectroscopy LI Ji-cheng(李继承)1, LIN Li (林 莉)1, LI Xi-meng(李喜孟)1, LI Guang(李 光)2, LEI Ming-kai(雷明凯)3 1... reflection coefficient spectroscopy (URCS). The URCS was analyzed based on an acoustic transmission model for the multi-layered structure. The longitudinal velocity in the coatings was calculated from......
features of LSS alloy are beneficial to the higher thermal conductivity and lower thermal expansion coefficient at room temperature. The fine Si particle in SD alloy is advantageous to improving the mechanical properties. The increasing rates of thermal expansion coefficient with temperature are influenced by the distribution of the Si particles, where a lower rate is obtained in SD alloy......
,their coefficient of thermal expansion(CTE) is determined by a stress relaxation process.While for the composites with higher nanoparticle concentration,their CTE is determined by a percolation process.关键词:...Thermal Expansion of Al Matrix Composites Reinforced with Hybrid Micro-/ nano-sized Al2O3 ParticlesZhibo Lei1,Ke Zhao1,Yiguang Wang1,Linan An21. School of Materials Science and Engineering......
SiO2层对Al/SiC电子封装材料热膨胀系数的影响[J]. 硅酸盐通报, 2009, 28(1): 71-75.WANG Tao. Influence of interface on the coefficient of thermal expansion of Al/SiC electronic packaging composite[J]. Bulletin of the Chinese...合材料的热膨胀系数,但前者起主导作用；金刚石和碳化硅在不同配比下的热膨胀系数随着复合材料中碳化硅含量的增加逐渐增大,Terner模型与Kerner模型的计算平均值能较好地预测实验结果. 关键词:复合材料；金刚石；碳化硅；热膨胀 中图分类号:TB333 文献标志码:A Thermal expansion behavior of diamond......
of aging temperature. The coefficient of thermal expansion (CTE) between room temperature and 100 ℃ of the AlSi27 alloy increases gradually with the increase of aging temperature. On the other hand, the CTE... residual stress; coefficient of thermal expansion 铝硅合金由于具有高热导率,低密度,以及与微电子系统相匹配的低热膨胀系数等优点,被广泛应用于电子封装领域[1-3].在电子封装中,封装壳体的热膨胀系数是一个关键的性能参数,近几年来得到了很多学者的重视和研究[4-6].他们一致认为,铝硅合金的热膨胀系数主要取决于合金中的硅含量,随着硅含量增大,材料的热膨胀系数......
reaction with ZrO2 and WO3 powders. The coefficient of thermal expansion (CTE) of the as-prepared ZrW2O8 was around -5.08×10-6 K-1 at 20–700℃. Different amounts of ZrW2O8 powders were added in BTDA-ODA...Preparation of Negative Thermal Expansion ZrW2O8 Powders and Its Application in Polyimide/ZrW2O8 CompositesJuan Yang,Yongsen Yang,Qinqin Liu,Guifang Xu and Xiaonong Cheng School of Materials Science......
of(ZrMg)6+ (ion radius 7.2 ×10-11 m) for Y3+ (ion radius 9×10-11 m), the crystal water are reduced obviously. The linear thermal expansion coefficient is improved with increasing the content of(ZrMg)6...Negative Thermal Expansion of (ZrMg)xY2-2xMo3O12 Ceramics with Low Hygroscopicity王献立1,FU Linjie1,XU Kun1,YANG Peng1,LU Xiansheng2,LIANG Erjun21. Physics Experiment Center, Zhengzhou University......
/Al composites have a low density of 2.93 g/cm3, and its relative density is 98.7%. Thermal conductivity of the composites is 175 W/(m·K), coefficient of thermal expansion (CTE) is 10.3×10-6 K-1... conductivity; coefficient of thermal expansion 1 Introduction Electronic packaging shell is an important component in integrated circuit chip packaging. The failure rate of a single component in the chip......
......
