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]Murr L E. Theory and practice of copper sulphide leaching in dump and in-situ[J]. Mine Sci, 1980, 12(3): 121-189. [2]Poortinga A T, Bos R, Norde W, et al. Electric double layer interactions......
[J]. Am Ceram Soc Bull, 1993, 72(1): 90-95. [5]Kumar A, McMillan P W, Tummala R R. Glass-ceramic structures and sintered multilayer substrate thereof with circuit patterns of gold, silver or copper[P......
, DU Chang-hua, HUANG Fu-xiang, et al. Wettability of Lead-free solder Sn-0.7Cu on the surface of copper[J]. Materials Review, 2004, 18(9): 99-101. [16]朱奇农, 罗乐, 肖克, 等. Ni对Sn96.5Ag3.5/Cu之间扩散行为的阻挡作用[J......
]El-Sawy A H, Fahmy M F. Brazing of Si3N4 ceramic to copper[J]. Journal of Materials Processing Technology, 1998, 77: 266-272. [3]Blugan J, Kuebler J R J. Properties and fractography of Si3N4/TiN......
. Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder[J]. Journal of Electronic Materials, 2004, 33(9): 990-1004. [7]Shawkret A, Mei S, Le L. Effects of static......
stainless steel induced by ultrasonic shot peening[J]. Mater Sci Eng A, 2000, 286: 91-95. [10] Sanders P G, Eastman J A, Weertman J R. Elastic and tensile behavior of nanocrystalline copper and palladium......
-xian, et al. The erosive property of copper infiltrated graphite throat insert[J]. Journal of Solid Rocket Technology, 2004, 27(1): 69-72. [13]黄海明, 杜善义, 吴林志, 等. C/C复合材料烧蚀性能分析[J]. 复合材料学报, 2001, 18(3......
M, et al. Studies on biosorption of zinc(Ⅱ) and copper(Ⅱ) on desulfovibrio desulfuricans[J]. International biodeterioration & biodegradation, 2000, 46: 11-18. [8]李亚新, 苏冰琴. 硫酸盐还原菌和酸性矿山废水的生物处理[J......
]. World Nonferrous Metals, 2007(1): 20-21. [2] ZHANG Xiao-juan, LI Xin-gang, CAO Hong-bin, ZHANG Yi. Separation of copper, iron (Ⅲ), zinc and nickel from nitrate solution by solvent extraction using......
. The Mg-14Al-0.5Mn melts were poured into a copper mold preheated at about 100 ?C to produce circular column samples of d16 mm×100 mm. The isothermal heat treatment was performed in an electric resistance......