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under different radial pressures. Effects of radial pressure on the thickness distribution were discussed and optimal radial pressure was determined. It is shown by numerical simulations... and thickness distribution is more uniform. Key words: aluminum alloy; hydroforming; radial pressure; fracture; thickness  ......
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Effects of PyC shell thickness on the microstructure, ablation resistance of SiCnws/PyC-C/C-ZrC-SiC compositesQinchuan He1,Hejun Li2,Xuemin Yin2,Jinhua Lu21. College of Materials and Chemistry.../pyrocarbon(SiCnws/PyC) core-shell structure toughenedC/C-ZrC-SiC composites were fabricated by CLVD process, and the influences of PyC shell thickness on the microstructure and ablation resistance......
. SMIT Center, Chalmers University of Technology, 412-96 G?teborg, Sweden) 摘 要:研究了Cu/Sn-3.0Ag-0.5Cu/Cu焊点在(150±1)℃时效温度下,0~1 000 h不同时间时效后焊点的拉伸断裂性能以及界面金属间化合物(IMC)的组织形态和成分.结果表明:随着时效时间的延长,焊点拉伸强度降低,拉伸断裂主要发生于Solder/IMC界面或/和IMC/IMC界面,而且断口形貌逐渐由韧窝状断口为主向解理型脆性断口转变.SEM研究发现,时效过程中界面IMC不断长大,增厚并呈针状或块状从Cu/Solder界面向焊点心部生长,时效1 000 h的焊点中IMC分层明显.半焊点结构为Cu/Cu3Sn/Cu6Sn5/Solder,同时,在靠近铜基体的IMC中有Kirkendall空洞存在. 关键词:金属间化合......
loads and the first buckling modes with those obtained through theoretical analysis. Two typical initial defects, non-circularity and uneven thickness distribution, were studied. Critical loads decline... cylindrical shell is under torsion. Unfortunately, it has a completely different buckling mode when cylindrical shell is under axial compression. Critical loads decline with the increase of thickness defect......
老化退火中Cu/AuSn20/Ni焊点的组织演变彭健1,王日初1,韦小凤1,刘锐1,王檬21. 中南大学材料科学与工程学院2. 江西理工大学材料科学与工程学院摘 要:研究Cu/AuSn20/Ni焊点在120,160和200℃下老化退火时金属间化合物(IMC)层的组织形貌,生长动力学以及焊点剪切性能.结果表明:在老化退火过程中,焊点Cu/AuSn20上界面形成AuCu和Au(Cu,Sn)复合IMC层,Ni/AuSn20下界面形成(Ni,Au,Cu)3Sn2四元IMC层;IMC层厚度随着退火时间延长而逐渐增大,其生长动力学分析表明AuCu层和Au(Cu,Sn)层的生长机制为体积扩散,而(Ni,Au,Cu)3Sn2层的生长机制为反应扩散;IMC层的长大速率随温度升高而增大;焊点的室温剪切强度随AuCu和Au......
Effects of Thickness on the Electrical Conductivity of Sputtered YSZ Film with Nanocrystalline Columnar Microstructure杨青青,LIN Zuoliang,孟彬,ZHU Xinkun,YANG Feng,WU ShanFaculty of Materials Science & Engineering, Kunming University of Science & Technology摘 要:In order to investigate the effect of the thickness on the electrical conductivity......
键合丝键合界面研究进展彭成,梁爽,黄福祥,钟明君,冉小杰重庆理工大学材料科学与工程学院摘 要:采用引线键合技术对集成电路进行封装时,键合丝与Al焊盘存在异质界面问题,对电子器件的使用性能有很大的影响.本文综述了键合参数,界面金属间化合物(IMC)演变行为及工作环境等方面对界面键合强度和可靠性影响的研究进展,并展望了未来发展前景.关键词:键合丝;界面;金属间化合物(IMC);键合强度;可靠性;......
Molecular Dynamics Simulation on Pressure and Thickness Dependent Density of Squalane Film潘伶,高诚辉School of Mechanical Engineering and Automation, Fuzhou University摘 要:Molecular dynamics(MD) simulations using the polymer consistent force field(PCFF) were adopted to investigate the pressure and thickness dependent density of squalane film in a nanogap......
Structure and Growth Mechanism of V/Ag Multilayers with Different Periodic Thickness Fabricated by Magnetron Sputtering DepositionHongxiu Zhang,Feng Ren,Mengqing Hong,Xiangheng Xiao,Guangxu Cai... layer thickness from 2 to 6 nm,and then became waved as the individual layer thickness increases to 8 nm.At the beginning of the growth,the morphology of the multilayers with small periodic thickness......