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Sn3.0Ag0.5Cu/Cu无铅焊点剪切断裂行为的体积效应田艳红1,杨世华1,王春青1,王学林1,林鹏荣1(1.黑龙江省哈尔滨市哈尔滨工业大学现代焊接生产技术国家重点实验室)摘 要:采用直径范围为200-600μm的Sn3.0Ag0.5Cu无铅钎料球在Cu焊盘上制作热风重熔焊点,将重熔焊点在150℃下进行老化,并对重熔和老化焊点进行剪切测试.结果表明:重熔和老化后焊点的剪切强度都随体积的增大而减小,表现出显著的体积效应.SEM断面观察显示:较小体积焊点剪切断裂发生在钎料块体内部,表现出较好韧性;较大体积焊点则......
reinforced Sn-1.0Ag-0.5Cu lead-free solder alloy [J]. Materials & Design, 2014, 55: 837-845. [12] EL-DALY A A, EL-TAHER A M, DALLOUL T R. Enhanced ductility and mechanical strength of Ni-doped...-containing Sn-1.5Ag-0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products [J]. Materials & Design, 2015, 65: 796-805. [26] ZHAO Jie, QI Lin, WANG Xiu-min......
-Zn alloys investigated. Key words: Sn-Zn alloys; lead-free solder; wettability; tensile strength; elongation; joint strength 经过近10年的努力, 世界范围内电子用无铅焊料的研制和发展取得了令人瞩目的成就. 人们不仅筛选出可能代替传统共晶Sn...金属学报, 2004, 14(10): 1694-1698. XIE Hai-ping, YU Da-qun, MA Hai-tao, et al. Microstructure, wettability and mechanical properties of Sn-Zn-Cu lead free solder[J]. The Chinese Journal of Nonferrous......
Effect of indium addition on the microstructural formation and soldered interfaces of Sn-2.5Bi-1Zn-0.3Ag lead-free solderMing-jie Dong, Zhi-ming Gao, Yong-chang Liu, Xun Wang, and Li-ming Yu School... 195?C), which is close to that of conventional eutectic Sn-Pb solder, the investigated solder presents superior wettability, solderability, and ductility. The refined equiaxial grains enhance......
.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed...Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrateCHEN Wenxue, XUE Songbai, WANG Hui, WANG Jianxin, and HAN Zongjie College of Materials......
of different electrolytes[J]. Microelectronics Reliability, 2008, 48(1): 105-110. [11] LIU M, XIAN A P. Tin whisker growth on the surface of Sn-0.7Cu lead-free solder with a rare earth (Nd) addition[J... Manufacturing Technology/International Micro-electronics Conference. Omiya: IEEE, 1998: 380-385. [55] YANADA I, OSAKA J. Electroplating of lead-free solder alloys composed of Sn-Bi and Sn-Ag[C]//Proceedings......
and discussion 3.1 Influence of laser output power on mechanical properties of QFP Sn-Ag-Cu micro-joints TQFP100 devices were soldered on PCB with Sn-Ag-Cu lead-free solder, and laser scanning speed... by molten Sn-Ag-Cu lead-free solder, and the best mechanical properties of micro-joints are gained at the same time. 3.2 Influence of laser output power on mechanical properties of QFP Sn-Cu-Ni......
, ZHAO Xin-hua. Study on the optimal free-lead solder alloy of Sn-Ag-Cu system[J]. Electronic Components & Materials, 2004, 23(8): 14-21. [4] 张柯柯, 王双其, 余阳春, 王要利, 樊艳丽. Sn-Ag-Cu-RE系无铅钎料与表面贴装元器件的润湿适配性[J...特性[J]. 特种铸造及有色合金, 2006, 26(9): 604-606.FAN Yan-li, ZHANG Ke-ke, WANG Shuang-qi, CHENG Guang-hui, WANG Yao-li, YU Yang-chun. Wettability of Sn-Ag-Cu lead-free solder containing low Ag for different......
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鑫. 微观压痕法测量 Sn-Ag-Cu 系无铅钎料的力学性能[J]. 中国有色金属学报, 2005, 15(5): 688-693. WANG Feng-Jiang, QIAN Yi-Yu, MA Xin. Measurement of mechanical properties of Sn-Ag-Cu series lead-free solder alloy by using micro.... Microstructure and tensile properties of Sn-9Zn-xAg lead-free solder alloys[J]. Scripta Materialia, 2003, 48(8): 1047-1051. [10] 吴文云, 邱小明, 殷世强, 孙大谦, 李明高. Bi, Ag 对 Sn-Zn 无铅钎料性能与组织的影响[J]. 中国有色金属学报, 2006, 16(1......