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LEE H M. Effect of Ag addition on the ripening growth of grains at the Interface of Sn-xAg-0.5 Cu/Cu during a reflow[J]. Components, Packaging and Manufacturing Technology, IEEE Transactions......
): 1577-1583. [32] Haseeb A S M A, Leng T S. Effects of Co nanoparticle addition to Sn-3.8Ag-0.7Cu solder on interfacial structure after reflow and ageing[J]. Intermetallics, 2011, 19(5): 707-712. [33... on IMC growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints in reflow process[J]. Journal of Alloys and Compounds, 2013, 554(25): 195-203. [43] Mohd S M A A, Bakri A M M A, Kamarudin H, et al. Solderability......