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components (IMCs) in solder joints, Zn was added into Sn-rich solders. The solder joints were fabricated by a laser reflow soldering method, and then they were aged at 125 ℃. The results show that the total... pads and circuits are made of Au, where Au is used as a soldering layer, and thickness of the Au layer can reach about several microns. Au will react with Sn in solders to form AuSnx intermetallics......
have opposite effect. Meanwhile the shear and tensile strengths of soldering joints can be improved by the promotion of tin content and the Bi/In ratio in Bi-Sn-In alloy. The melting temperature...量的关系(b) Fig.6 Variation of shear strength of Bi-Sn-In soldering joints with content of Sn and ratio of Bi to In(a), and content of In(b) 3 讨论 3.1 合金元素的作用 由Bi-Sn, Bi-In, Sn-In二元相......
:1672-7207(2011)12-3674-06 Influences of soldering process on structure and shear strength of InAg solder LIU Wen-sheng, HUANG Guo-ji, MA Yun-zhu, PENG Fen, CUI Peng (State Key Laboratory for Powder... at 150 ℃ for 1 min is the appropriate soldering process. In this condition, the solder joint with shiny surface, good wettability, less solder flux residue is obtained, and the microstructure......
; accepted 14 September 2009 Abstract: A novel Sn-2.5Ag-2.0Ni alloy was used for soldering SiCp/Al composites substrate deposited with electroless Ni(5%P) (mass fraction) and Ni(10%P) (mass fraction... including epoxies and solders[9]. Among them, Sn2.5Ag2.0Ni solder is well suited for soldering optoelectronic devices and hermetic sealing applications. In this study, Sn2.5Ag2.0Ni is used to join SiCp/Al......
; 文献标志码:A Effect of Ni and Bi addition on growth rate of intermetallic compound of SnAgCu soldering LIU Yang, SUN Feng-lian (School of Materials Science and Engineering...(LASAC) soldering were investigated by accelerated temperature aging. The thermal fatige resistance of LASAC solders with Ni and Bi addition was studied by comparing with SAC305 solder. The results......
-Cu solder by forming appropriate rod-like shape fine IMC crack pinning and strengthening β-Sn soft matrix, thus strengthening its soldering and vibration mechanical properties which are close to those... on fabrication of a low melting point lead-free Sn-Bi-X solders and lead-free soldering process[D]. Changsha: Hunan University, 2007: 1-5. [7] MITLIN D, RAEDER C H, MESSLER R W. Solid solution creep behavior......
-solid reaction for 10 min, the initial Cu6Sn5 and Ni3Sn4 form during immersing soldering at the Sn/Cu and Sn/Ni interfaces, and both transform into (Cu,Ni)6Sn5, their morphologies change from scallop... Fig. 2 Microstructures of Cu/Sn/Ni interconnect after immersing soldering: (a) Entire micrograph; (b) Sn/Ni interface; (c) Sn/Cu interface 图3所示为Cu/Sn/Ni焊点在250 ℃液-固界面反应不同时间后界面微观组织演变.图3(a),(c),(e......
related with the soldering peak temperature, cooling rate and the thermal gradient of the interface of joints; the distribution of IMC is related with solder composition and the diffusivity of metal......
slow down the deterioration of mechanical property, and improve the reliability of soldering joints. Key words: AuSn solder; heterogenous interface; coupling reaction; intermetallic compounds (IMC......
without increasing the soldering temperature [2-3]. However, some obvious disadvantages, such as poor wettability and easy oxidation, limit the practical use of the alloys [2-4]. Generally, two ways are used to improve the performance of Sn-Zn alloys: one is to develop or optimize the formulation of flux which is fitted for the soldering, and the other is to improve oxidation resistance by alloying......