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:Similar diffusion bonding of 1Cr11Ni2W2MoV stainless steel was conducted at different bonding temperatures. The interface characteristics and mechanical... was ascribed to the combined effects of plastic flow of materials around voids,interface diffusion and volume diffusion. Owing to the elimination of void from the bonding interface,the sound joint obtained......
Diffusion Bonding of Ti-6Al-4V to QAl 10-3-1.5 with Ni/Cu InterlayersWei GUO, Xihua ZHAO, Minxia SONG, Jicai FENG and Biao YANG Key Laboratory of Automobile Materials (Jilin University), Ministry..., Harbin 150001, China摘 要:<正>Ti-6Al-4V and QAl 10-3-1.5 diffusion bonding has been carried out with Ni/Cu interlayers. The diffusion-bonded joints......
Transient Liquid Phase Bonding of IN738LC/MBF-15/IN738LC:Solidification Behavior and Mechanical PropertiesB.Binesh,A.Jazayeri Gharehbagh摘 要:Transient liquid phase(TLP) bonding of IN738 LC superalloy was carried out using a rapidly solidified MBF-15 Ni-based foil. The effects of bonding temperature(1130–1170 °C) and time(5–120 min) as well as foil......
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Superplasticity and Diffusion Bonding of Ti3AI Intermetallic CompoundsYi GUO Peng LIU Yiwen WU Zijing HE Dong LI Institute of Metal Research,Academia Sinica,Shenyang,110015,China摘 要:bonding technology and good joints were created,the simulatedspecimens were......
Lightweight epoxy-based abradable seal coating with high bonding strengthYun-Qi Tong,Qiu-Sheng Shi,Mei-Jun Liu,Guang-Rong Li,Chang-Jiu Li,Guan-Jun YangState Key Laboratory for Mechanical Behavior..., a new lightweight epoxy-based abradable seal coating with high bonding strength was developed by an effective and porosity controllable mixing process that distributes spherical pores uniformly......
Cross section morphologies of Al2O3-13%TiO2 coating/micro-porous bonding layer 图3 陶瓷层与粘结层界面高倍微观形貌,局部高倍SEM,陶瓷层的XRD谱及陶瓷层与粘结层界面线元素扫描分析曲线 Fig.3 High morphology of interface of ceramic layer and micro-porous bonding layer(a), local high magnification SEM image in Fig.3(a) of graph(b), XRD patterns of ceramic layer(c) and line scan of interface of ceramic layer and bonding layer(d) 图4......
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. Key words: ultrasonic wave; horn; wire bonding 超声波是一种机械波, 在微电子封装领域中被广泛应用于热超声金丝球引线键合(Thermosonic golden ball wire bonding), 超声楔键合(Ultrasonic wedge bonding)和热超声倒装(Thermosonic flip chip). 在这些应用中, 变幅杆是超声波传递和聚集的部件, 研究超声波在变幅杆中的......
(2010)06-2149-07 Phosphate bonding characteristic of NiFe2O4/Cu cermet and metal ZHANG Lei, CHEN Zi, LI Zhi-you, ZHOU Ke-chao, LI Chao (State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China) Abstract: An adhesive bonding technology of NiFe2O4/Cu cermet and 45# steel was investigated using aluminum chromium phosphate as binder, CuO as curing agents......