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for different times REFERENCES [1] 刘 洋, 孙凤莲. Ni和Bi元素对SnAgCu 钎焊界面金属化合物生长速率的影响[J]. 中国有色金属学报, 2012, 22(2): 460-464.LIU Yang, SUN Feng-lian. Effect of Ni and Bi addition on growth rate of intermetallic compound of SnAgCu soldering[J]. The Chinese Journal of Nonferrous Metals, 2012, 22(2): 460-464. [2] LEJUSTE C, HODAJ F, PETIT L. Solid state interaction between a Sn-Ag-Cu-In solder alloy and Cu substrate[J......
amorphous alloy powders by close-coupled gas atomization[J]. Journal of University of Science and Technology Beijing, 2008, 30(1): 35-39. [9] 刘文胜, 彭 芬, 马运柱, 崔 鹏, 陈仕奇, 刘有长. 工艺条件对气雾化制备SnAgCu合金粉末特性的影响[J]. 中国有色金属学报, 2009, 19(6): 1074-1079.LIU Wen-sheng, PENG Fen, MA Yun-zhu, CUI Peng, CHEN Shi-qi, LIU You-chang. Effect of procedure conditions on characteristics of SnAgCu alloyed powder prepared......
SnAgCu无铅焊点电迁移可靠性的影响[J]. 电子元件与材料, 2008, 27(8): 65-67. HE Hong-wen, XU Guang-chen, GUO Fu. Effect of Sb doped SnAgCu lead-free solder joint on electromigration reliability[J]. Electronic Components...: Harbin University of Science and Technology, 2009: 23-28. [6] 史耀武, 雷永平, 夏志东, 刘建萍, 李晓延, 郭 福. 电子组装用SnAgCu系无铅焊料合金与性能[J]. 有色金属, 2005, 57(3): 8-15.SHI Yao-wu, LEI Yong-pin, XIA Zhi-dong, LIU Jian-ping, LI Xiao......
of liquidus and solidus upward. Because the melting temperature of Ce is 3-4 times as high as that of SnAgCu sample, the melting temperature of the alloy rises slightly after adding Ce. Fig.1 Melting... and EDX analysis. The results show that black new phase is RE compound phase, the white around is ternary eutectic structure of SnAgCu and the dark in the middle is Sn-Ce phase. As shown in Fig.3......
描电镜照片 Fig.2 SEM image of Sn-3.5Ag-0.5Cu/Cu interface before aging 表1 SnAgCu/Cu界面及其近域IMC的能谱分析结果 Table 1 EDX analysis of IMC at SnAgCu/Cu interface and its neighborhood (mole... of Sn-Ag-Cu system[J]. Electronic Components and Materials, 2004, 23(8): 14-16, 21. [9]Luo W C, Kao C R. Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finish......
, LIU Jim. Evolutions of the interface and shear strength between SnAgCu–xNi solder and Cu substrate during isothermal aging at 150 ℃[J]. Journal of Alloys and Compounds, 2009, 486(1/2): 474-479. [11] 王要利, 张柯柯, 李臣阳, 衡中皓. RE对SnAgCu钎料合金及焊点性能的影响[J]. 材料热处理学报, 2011, 32(12): 35-37.WANG Yao-li, ZHANG Ke-ke, LI Chen-yang, HENG Zhong-hao. Effect of RE on properties of SnAgCu solder alloy and its joints[J......
]. Trans Nonferrous Met Soc China, 2006, 16(s1): s739-s743. [3] SUNDELIN J J, NURMI S T, LEPIST? T K, RISTOLAINEN E O. Mechanical and microstructural properties of SnAgCu solder joints[J]. Mater Sci..., 2006, 35: 2088-2097. [5] CHEN Zhi-gang, SHI Yao-wu, XIA Zhi-dong, YAN Yan-fu. Properties of lead-free solder SnAgCu containing minute amounts of rare earth[J]. Journal of Electronic Materials, 2003, 32......
on a lot of unrealistic assumptions[19]. The global trend of lead free soldering makes lead-free solders, especially the SnAgCu solder, gradually substitute for the Sn-Pb solder in solder jet packaging. However, few studies have been devoted to simulating the SnAgCu solder bump formation during the solder jet process. The aim of the present work is to develop a full CFD model based on VOF method......
[1-6],所以,集成电路的电迁移问题已经成为决定集成电路稳定性的关键.特别是在近十几年倒装芯片技术引入之后,Sn基焊料的电迁移问题得到了广泛的关注[7-8]. 到目前为止,研究者已经做了大量的实验和理论工作来研究SnPb,SnAg,SnCu,SnBi和SnAgCu合金焊料节点的电迁移机制[9-13],发现在共晶SnPb焊料的电迁移过程中由Sn还是Pb作为主控扩散元素是由温度决定的[10].然而,在SnBi共晶焊料中,Bi是主扩散元素；在SnCu和SnAgCu共晶焊料里,Cu是主扩散元素.在SnZn和SnIn等焊料中同样存在电迁移的问题[14-15],如何抑制电迁移成为众多研究者关注的问题.杨启亮[16]在SnBi共晶合金中加入少量的Sb,发现Bi在阳极的析出得到抑制,且Sb原子对Sn相中Bi原子的抑制迁移能力在Sb原子达到饱和固溶度时最大,Sb-Bi的结合能大于Sn-Bi的,Sb的加入使......
additions on the reaction between SnAgCu solder and Cu[J]. Journal of Alloys and Compounds, 2009, 478(1/2): 121-127. [5] 刘建萍, 阎焉服, 郭 福, 赵玉珍, 史耀武. 纳米银颗粒增强复合钎料的研究[J]. 焊接学报, 2004, 33(4): 38-40. LIU Jian-ping.... [14] WANG Y W, LIN Y W, TU C T, KAO C R. Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu[J]. Journal of Alloys and Compounds, 2009, 478(1/2): 121-127. [15......
