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intensively [1,2]. Low temperature soldering is very important for the electronic components which are sensitive to the heat input in electronics industries [3]. The melting point of the Sn-Zn... (IMC) are major issues in soldering. Some investigations were carried out on the IMC growth at various soldering temperature during aging [7,8]. SUGANUMA et al [9] reported that the Sn-9Zn/Cu......
in the past for soldering due to its good wettability, solderability, low cost and low melting temperature. However, Pb is a toxic heavy metal now forbidden for soldering use in electronic devices [1-3... the interfacial layer, and the growth of the interfacial layer occurs rapidly during the soldering process [5]. One of the methods commonly used to solve the problems of these solders is the addition......
of stainless steel. It has been documented that one critical factor for reducing the life cycle of a die has emerged as soldering between aluminum alloys and the die mold materials, resulting in the phenomenon that the surface defect of the die mold originated from soldering provides serious defects for casting products[1-5]. In order to avoid the soldering between aluminum alloys and the die mold......
substrate, reducing the tearing tendency in interface during soldering process. However, hardening and tendering occur due to the excessive addition of Bi in Sn-Zn alloy. On the other hand, with the Bi... resistance and soldering joint reliability of Sn-9Zn and Sn-9Zn-0.1Ni alloys. Previous studies also analyzed the better overall properties of a rapidly solidified Sn-9Zn-0.1Cr alloy [15,16]. Sn-8Zn-3Bi......
been demonstrated that lead-free soldering is technologically possible and has some advantages, there are many technical issues to be addressed before it is well implemented. The Sn-Ag-Cu alloys... affected by the intermetallic layers formed at solder/under bump metallurgy(UBM) interface during reflow soldering as well as aging, need to be evaluated thoroughly. In high-density electronic......
and then followed by In-Bi soldering. The aim of the present work is to investigate the effects of different metallic Ag coating processes and annealing temperatures of Ag precoating layer... prior to In-Bi soldering. In this work, silver particles were made in the distilled water with stainless plates cathode and Ag plates anode by electrolysis method. The nano scale oxide or hydroxide......
expansion, thermal diffusivity and specific heat), mechanical properties (ultimate flexural strength and Brinell hardness), and electroplating and soldering tests. From thermal diffusivity... determined on Netzsch DSC204 in University of Science & Technology Beijing. Electro-plating tests were conducted in No.55 Institute in Nanjing. Soldering tests, the 3-point bending and Brinell......
of the lead-free alloys is the alloy based on the Sn-Ag-Cu system, this alloy has high melting point up to 217℃, resulting in the increase of soldering temperature[1-3]. Sn-Zn eutectic alloy has...(a), it is obvious that the effectiveness of La is not as strong as Nd. Moreover, temperature shows a strong effect on the surface tension of La-contained Sn-8Zn-3Bi solders. It indicates that soldering......
alloys with different additives, such as Ag, Bi, Cu, In, Sb and Zn, are potential candidates as Pb-free solders[5-7]. The Sn-Bi alloys with low melting point are developed for soldering the temperature-sensitive components in the step-by-step packaging process[7-9]. On the other hand, Ni is plated as an under bump metallurgy (UBM) layer on the substrate prior to soldering in modern......
by the Arrhenius equation. Key words: bulk metallic glass; compound layer; kinetics; diffusion mechanism 1 Introduction Among many bonding techniques, soldering has become an important joining technology... during soldering [3,4]. It is desirable to achieve a good metallurgical bond while forming a thin intermetallic compound layer. However, excessive intermetallic compounds growth may have a deleterious......