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related with the soldering peak temperature, cooling rate and the thermal gradient of the interface of joints; the distribution of IMC is related with solder composition and the diffusivity of metal......
slow down the deterioration of mechanical property, and improve the reliability of soldering joints. Key words: AuSn solder; heterogenous interface; coupling reaction; intermetallic compounds (IMC......
Jian-xin, YAO Li-hua. Microstructures of Sn-Ag-Cu lead-free soldered joints with diode-laser soldering [J]. Journal of Central South University: Science and Technology, 2006, 37(2): 229-234. (in Chinese... in using lead in solders, large efforts to develop lead-free soldering have been made in recent years. The most favored lead-free solder alloys recognized by the electronics industry today mainly consist......
Song-bai, FANG Dian-song, WANG Jian-xin, YAO Li-hua. Microstructures of Sn-Ag-Cu lead-free soldered joints with diode-laser soldering [J]. Journal of Central South University: Science and Technology... bonding[4], transient liquid phase bonding[5], gas shielded arc welding[6], laser welding [7-8] have been used to weld these materials. Among the above-mentioned welding technologies, the fusion......
without increasing the soldering temperature [2-3]. However, some obvious disadvantages, such as poor wettability and easy oxidation, limit the practical use of the alloys [2-4]. Generally, two ways are used to improve the performance of Sn-Zn alloys: one is to develop or optimize the formulation of flux which is fitted for the soldering, and the other is to improve oxidation resistance by alloying......
intensively [1,2]. Low temperature soldering is very important for the electronic components which are sensitive to the heat input in electronics industries [3]. The melting point of the Sn-Zn... (IMC) are major issues in soldering. Some investigations were carried out on the IMC growth at various soldering temperature during aging [7,8]. SUGANUMA et al [9] reported that the Sn-9Zn/Cu......
in the past for soldering due to its good wettability, solderability, low cost and low melting temperature. However, Pb is a toxic heavy metal now forbidden for soldering use in electronic devices [1-3... the interfacial layer, and the growth of the interfacial layer occurs rapidly during the soldering process [5]. One of the methods commonly used to solve the problems of these solders is the addition......
of stainless steel. It has been documented that one critical factor for reducing the life cycle of a die has emerged as soldering between aluminum alloys and the die mold materials, resulting in the phenomenon that the surface defect of the die mold originated from soldering provides serious defects for casting products[1-5]. In order to avoid the soldering between aluminum alloys and the die mold......
substrate, reducing the tearing tendency in interface during soldering process. However, hardening and tendering occur due to the excessive addition of Bi in Sn-Zn alloy. On the other hand, with the Bi... resistance and soldering joint reliability of Sn-9Zn and Sn-9Zn-0.1Ni alloys. Previous studies also analyzed the better overall properties of a rapidly solidified Sn-9Zn-0.1Cr alloy [15,16]. Sn-8Zn-3Bi......
been demonstrated that lead-free soldering is technologically possible and has some advantages, there are many technical issues to be addressed before it is well implemented. The Sn-Ag-Cu alloys... affected by the intermetallic layers formed at solder/under bump metallurgy(UBM) interface during reflow soldering as well as aging, need to be evaluated thoroughly. In high-density electronic......