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Ce on microstructures of Sn-3.0Ag-0.5Cu solder alloy were studied. The results indicate that microstructures of Sn-Ag-Cu-Ce solder alloy are composed of Sn-rich phase and eutectic structures... compounds (IMC) and Ce compounds also exist. Microstructure of solder alloy becomes finer with the increase of the content of Ce, and the optimum content of Ce is about 0.03%, the binary eutectic of needle......
Crack Initiation and Propagation Evaluation for Sn–5Sb Solder Under Low-Cycle FatigueNoritake HiyoshiDivision of Engineering, Faculty of Engineering, University of Fukui摘 要:In this study, a crack initiation and propagation behavior of Sn–5Sb lead-free solder under low-cycle fatigue is discussed. Cyclic push–pull loading tests with a single-hole specimen......
concentration. Finally, theoretical analysis was employed to illustrate the influence of reactant concentration on the particle size. Key words: chemical reduction method; lead-free solder; SnAgCu alloy... paid to the development of new lead-free solders. Among them, the Sn-Ag-Cu (SAC) alloy system is the most promising candidate that can replace the Sn-Pb solder. The eutectic Sn3.0Ag0.5Cu is widely used......
, MOHAMAD A A. Interfacial reaction of Sn-Ag-Cu lead-free solder alloy on Cu: A review [J]. Advances in Materials Science and Engineering, 2013, 2013: 1-11. [5] AMAGAI M. A study of nanoparticles in Sn-Ag... are being replaced by the binary and ternary lead-free Sn-based solder systems. The binary solder system is realized by incorporating alloying elements (e.g., Zn, Bi, In, Cu, Ag) into the Sn-based solder......
,在本试验条件下,导液管突出高度最佳为4 mm. 关键词:无铅焊锡粉末; 气体雾化; 导液管突出高度; 粉末特性; Sn-Ag-Cu lead-free solder powder; gas atomizing; protrusion height of delivery tube; powder properties; [全文内容正在添加中] ......
better shear strength than that of SAC105 solder alloy.关键词:...Modification of Sn–1.0Ag–0.5Cu solder using nickel and boronJun-Feng Qu1,2,Jun Xu1,2,Qiang Hu1,2,Fu-Wen Zhang1,2,Shao-Ming Zhang1,21. National Engineering Research Center for Nonferrous Metal......
, 2010, 504: L5-L9. [4] SU Y A, TAN L B, TEE T Y. Rate-dependent properties of Sn-Ag-Cu based lead free solder joints[C]//Electronic Packaging Technology Conference. Singapore: IEEE Inc, 2009: 283-291.... REFERENCES [1] ANDERSON I E. Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications[J]. J Mater Sci: Mater Electron, 2007, 18: 55-76. [2] 张新平, 尹立孟, 于传宝. 电子和光子封装无铅钎料的研究和应用进展......
, developing lead-free free-cutting brass materials has become a necessary and significant research focus. Lead-free brass is designed by adding free- machining additives into Cu–Zn alloy instead of lead..., AGRAWAL A N. Corrosion and dealloying of cast lead-free copper alloy–graphite composites [J]. Corrosion Science, 2000, 42(9): 1553-1571. [8] KIM J K, ROHATGI P K, CHOI J O, CHOI C O. Wear properties......
Effect of Cobalt Doping on the Microstructure and Tensile Properties of Lead Free Solder Joint Subjected to ElectromigrationM.Nasir Bashir,A.S.M.A.Haseeb,Abu Zayed Mohammad Saliqur Rahman,M.A.FazalDepartment of Mechanical Engineering, University of Malaya摘 要:Rapid Cu diffusion is one of the main causes of electromigration(EM) failure in lead-free solder......
Effect of Rare Earth Elements on Solidification Microstructure and High Temperature Mechanical Property of Sn60-Pb40 Solder alloy () [全文内容正在添加中] ......