共搜索到1677条信息,每页显示10条信息,共168页。用时:0小时0分0秒375毫秒
......
; 化学镀; 缓冲剂; 耐蚀性; 结合力 中图分类号: TQ153.1 文献标识码: A Electroless nickel plating on magnesium alloy in solution with NiSO4 as main salt LI Jian-zhong1, SHAO Zhong-cai2, TIAN Yan-wen1 (1. School...: The electroless nickel-plating on magnesium alloy was studied, using NiSO4 as the main salt in the electroless plating alkaline solutions. The effects of the buffer agent and plating parameters......
......
and mechanical properties of Al matrix composites were investigated. Surface modification of SiC particles with Cu, Ni and Cu/Ni, respectively, was carried out by electroless plating method. SiCp/Al composites... composites, the σUTS and εf are enhanced by 19.3% and 57.5%. Key words: SiCp/Al composite; surface modification; electroless plating; mechanical properties; interfacial bonding Cite this article as: LU Pin......
......
极化测试表明,镀镍以后的合金在阳极极化过程中发生了明显的钝化,耐腐蚀性能进一步提高,对基体起到了较好的防护作用. 关键词:镁合金;化学转化处理;化学镀镍;耐腐蚀性能 中图分类号:TG 174.4 文献标识码:A Effect of chemical conversion film plus electroless nickel plating... 110016, China) Abstract: In order to improve the corrosion resistance of as cast A291D alloy, electroless nickel plating combined with chemical conversion treatment was investigated in detail......
Ni-P-Nanodiamond composite electroless platingYongwei ZHU*,Yongjun CHEN and Changhong ZHU College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China Xiangqian SHEN School of Materials Science and Technology,Jiangsu University,Zhenjiang 212013,China摘 要:The effect of nanodiamond content......
/graphene sheets by an electroless Ni-plating method[J]. New Carbon Materials, 2012, 27(1): 35-41. [17] ZHAO C, WANG J. Fabrication and tensile properties of graphene/copper composites prepared by electroless plating for structrual applications[J]. Physica Status Solidi A, 2014, 211(12): 2878-2885. [18] CHU K, JIA C C. Enhanced strength in bulk graphene-copper composites[J]. Physica Status Solidi......
resistance, wear resistance, conductivity and electromagnetic shielding properties. The electroless plating Ni-P as bottom layer following the electroplating nickel as surface layer on AZ91D magnesium... resistance. The experimental results indicate that the dual coating is uniform, compact and pore-free. The adhesion strength between magnesium alloy substrate and electroless plating Ni-P bottom layer......
; accepted 25 May 2015 Abstract: The electroless deposition process of copper plating consisting of TEA and EDTA as complexing agents, paraformaldehyde as reducing agent, and 2-mercaptobenzothiozole as stabilizer and gelatin and animal glue as additives was investigated. The stability of the electroless copper solution was monitored by measuring the absorbance of the solution with a UV-Visible......