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Influence of welding parameters on interface evolution and mechanical properties of FSW Al/Ti lap jointsMingrun Yu1,2,Hongyun Zhao2,Zhihua Jiang2,Zili Zhang2,Fei Xu2,Li Zhou1,2,Xiaoguo Song1,21... or traversing rate decreased.Two types of Al/Ti interfaces–mixed interface and diffusive interface–were formed under different welding conditions.The diffusive interface was formed with low heat input......
Interface structure of ultrasonic wedge bonding joints of Ni/Al LI Jun-hui(李军辉), HAN Lei(韩 雷), ZHONG Jue(钟 掘) (School of Mechanical-Electronical Engineering, Central South University... the microstructure characterization of the wedge bond interface. Bond lift-off characteristics were studied by using scanning electron microscopy(SEM) with EDS-test. Characteristics of input power of PZT......
Study on NiO/Fe interface with X-ray photoelectron spectroscopyChun Feng1,2), Jing-yan Zhang1), Jiao Teng1), and Fu-ming Wang2) 1) School of Materials Science and Engineering, University of Science... of the atoms on the substrates. The interfacial reactions are effectively suppressed by inserting a thin Pt layer at the NiO/Fe interface.关键词:......
of atoms shows site selectivity behaviors and each stable interface forms a distinctive transition interface. The atom jump selects the optimist way to induce the migration of interface, and the atomic... of interfaces, Ni and Al segregate but V depletes. The degrees of segregation and depletion are also different at different interfaces. Key words: interface migration; solute segregation; site selectivity......
Interface evolution of Cu-Ni-Si/Al-Mg-Si clad composite wires after annealingZhen Yang,Xu-Jun Mi,Xue Feng,Hao-Feng Xie,Li-Jun Peng,Guo-Jie Huang,Yan-Feng Li,Xiang-Qian YinKey Laboratory of Nonferrous Metals and Processes,GRIMAT Engineering Institute Co.,Ltd摘 要:Interface micros tructures of Cu-Ni-Si/Al-MgSi clad composite wires during isothermal......
and interface microstructure of new type Ag-Cu-Ge solder YUE Yi-xin1, TAN Cheng-yu1, ZHENG Zi-qiao1, LI Shi-chen1, YE Jian-jun2 (1. School of Materials Science and Engineering, Central South... were found in interface. Key words: Ag-Cu-Ge; solder; wettability; interface 在电子工业领域, 常采用金基[1-3]和银基合金[4, 5]进行电器构件的分级钎焊, 这些焊料的共同特点是合金蒸汽压低, 流动性好, 焊接强度高, 耐腐蚀, 塑性好. 银基焊料由于有价格优势, 其应用更为普遍. 对于......
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Behaviors of Oxide Layer at Interface between Semi-solid Filler Metal and Aluminum Matrix Composites during VibrationLei Shi, Jiuchun Yan, Yanfei Han and Bo Peng State Key Laboratory of Advanced Welding and Joining, School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China摘 要:The joint interface between semi-solid......