共搜索到1265条信息,每页显示10条信息,共127页。用时:0小时0分0秒468毫秒
Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology HAN Zong-jie(韩宗杰)1, XUE Song-bai(薛松柏)1, WANG Jian-xin(王俭辛)1, ZHANG Xin(张 昕)1...; Abstract: Soldering experiments of quad flat package(QFP) devices were......
......
Trans. Nonferrous Met. Soc. China 28(2018) 748-756 Direct active soldering of Al0.3CrFe1.5MnNi0.5 high entropy alloy to 6061-Al using Sn-Ag-Ti active solder L. C. TSAO1, S. Y. CHANG2, Y. C. YU1 1... and shear strengths of HEA/HEA and HEA/6061-Al joints were determined after direct active soldering (DAS) in air with Sn3.5Ag4Ti active filler at 250 °C for 60 s. The results showed that the diffusion......
spectrum analyzer. Through the analysis on the microstructure and shear fracture of the soldering joint, the influence mechanism of IMC on the toughness of soldering joint was studied. The results show... fine eutectic structure in the soldering beam, and the toughness of soldering joint is improved. Key words: Sn2.5Ag0.7Cu; solder; intermetallic compound (IMC); rapid solidification; soldering 近几年来,利用......
rate. The shear strength of solder joints decreases with isothermal aging time increases, and it decreases from 5.94 MPa after soldering to 2.35 MPa after 1000 h aging. The fracture type is ductile... words: In-3Ag solder; intermetallic compound; isothermal aging; shear property; soldering 热连接是焊点连接的主要任务之一,随着电子行业向高密度,细间距和高集成化发展.焊点尺寸越来越小,封装结构越加复杂,焊点需要承受更大的负载,因此散热性能成为影响电子产品可靠性的一个关键因素.在电子产品的使用和服役过程中,器件产生的热......
of uniform interface. Key words: rapid solidification; Sn-6.5Zn solder; soldering joint; microstructure; mechanical properties 铅及其化合物由于具有毒性而被世界上多个国家禁止用于电子工业领域,因此,高性能无铅钎料的研究与开发成为近年来保证与提高微连接可靠性的关键技术之一[1-2].目... for soldering joint (mm): (a) Base metal; (b) Soldering joint 2 结果与分析 2.1 微观结构 本试验条件下制备的快速凝固态Sn-6.5Zn合金薄带厚度约60 μm,其凝固散热方式可以认为属于牛顿冷却方式,瞬时冷却速度可通过下式计算[15-16]:  ......
Soldering of Zr-based bulk metallic glass and copper by Au-12Ge eutectic alloyJun Wang,Jing Cui,Hong-Chao Kou,Heng Guan,Jin-Shan LiState Key Laboratory of Solidification Processing, Northwestern...-based metallic glass of 18 μm is shown to be the best for the soldering, while the surface roughness has a weak effect on the soldering behavior of Au-12 Ge solder on copper. After soldering, long-range......
Rapid Ultrasonic-Assisted Soldering of AZ31B Mg Alloy/6061 Al Alloy with Low-Melting-Point Sn–xZn Solders Without Flux in AirZhi-Wei Lai1,2,3,Zhe-Yuan Huang2,4,Chuan Pan3,Hui-Qiao Du5,Xiao-Guang...-assisted low-temperature soldering was developed to join AZ31B Mg alloy and 6061 Al alloy with a series of Sn–x Zn solders. The average maximum shear strength of the joints reaches up to 87.5 MPa......
Wetting Behavior and Interfacial Reactions in (Sn-9Zn)-2Cu/Ni Joints during Soldering and Isothermal AgingNing Zhao, Haitao Ma, Haiping Xie and Lai Wang School of Materials Science and Engineering... microstructure in (Sn-9Zn)-2Cu/Ni joints during soldering as well as isothermal aging were studied. The wetting ability of eutectic Sn-9Zn solder on Ni substrate was markedly improved by adding 2 wt pct Cu......
Significant Inhibition of IMCs Growth between an Electroless Ni-W-P Metallization and SAC305 Solder During Soldering and Aging徐涛1,胡小武1,2,LI Yulong1,JIANG Xiongxin1,YU Xiao11. Key Lab for Robot...) solder joint during soldering and aging were investigated. The soldering was performed at 250 ℃ for 10 min, followed by air cooling and aging treatment at 150 ℃ up to 15 days. The results show......