Microstructure and properties of electronic packaging shell with high silicon carbide aluminum-base composites by semi-solid thixoforming
来源期刊：中南大学学报(英文版)2014年第11期
论文作者：GUO Ming-hai(郭明海) LIU Jun-you(刘俊友) JIA Cheng-chang(贾成厂) JIA Qi-jin(贾琪瑾) GUO Shi-ju(果世驹)
文章页码：4053 - 4058
Key words：high silicon carbide aluminum-base composites; electronic packaging; semi-solid thixoforming; thermal conductivity; coefficient of thermal expansion
Abstract: The electronic packaging shell with high silicon carbide aluminum-base composites was prepared by semi-solid thixoforming technique. The flow characteristic of the SiC particulate was analyzed. The microstructures of different parts of the shell were observed by scanning electron microscopy and optical microscopy, and the thermophysical and mechanical properties of the shell were tested. The results show that there exists the segregation phenomenon between the SiC particulate and the liquid phase during thixoforming, the liquid phase flows from the shell, and the SiC particles accumulate at the bottom of the shell. The volume fraction of SiC decreases gradually from the bottom to the walls. Accordingly, the thermal conductivities of bottom center and walls are 178 and 164 W·m-1·K-1, the coefficients of thermal expansion (CTE) are 8.2×10-6 and 12.6×10-6 K-1, respectively. The flexural strength decreases slightly from 437 to 347 MPa. The microstructures and properties of the shell show gradient distribution.
GUO Ming-hai(郭明海), LIU Jun-you(刘俊友), JIA Cheng-chang(贾成厂), JIA Qi-jin(贾琪瑾), GUO Shi-ju(果世驹)
(School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China)
Abstract:The electronic packaging shell with high silicon carbide aluminum-base composites was prepared by semi-solid thixoforming technique. The flow characteristic of the SiC particulate was analyzed. The microstructures of different parts of the shell were observed by scanning electron microscopy and optical microscopy, and the thermophysical and mechanical properties of the shell were tested. The results show that there exists the segregation phenomenon between the SiC particulate and the liquid phase during thixoforming, the liquid phase flows from the shell, and the SiC particles accumulate at the bottom of the shell. The volume fraction of SiC decreases gradually from the bottom to the walls. Accordingly, the thermal conductivities of bottom center and walls are 178 and 164 W·m-1·K-1, the coefficients of thermal expansion (CTE) are 8.2×10-6 and 12.6×10-6 K-1, respectively. The flexural strength decreases slightly from 437 to 347 MPa. The microstructures and properties of the shell show gradient distribution.
Key words:high silicon carbide aluminum-base composites; electronic packaging; semi-solid thixoforming; thermal conductivity; coefficient of thermal expansion
