玻璃包覆纯铜微丝耐腐蚀性能及电学性能

来源期刊:中国有色金属学报2007年第11期

论文作者:谢建新 胡志勇 张志豪 黄霞

文章页码:1739 - 1739

关键词:玻璃包覆纯铜微丝;盐雾腐蚀;击穿电压;软化击穿温度

Key words:glass-coated pure copper microwire; salt spray test; breakdown voltage; cut through temperature

摘    要:

制备硼硅酸盐玻璃包覆纯铜微丝,其主要尺寸范围为:铜丝直径4~30 μm,玻璃包覆层厚度2~8 μm;对微丝的耐腐蚀性能和电学性能进行评价。结果表明:玻璃包覆纯铜微丝在中性盐雾实验条件下,抗潮热盐雾腐蚀时间在240 h以上;对于外径25 μm、包覆层厚度3.2 μm和外径18 μm、包覆层厚度2.5 μm玻璃包覆纯铜微丝,平均击穿电压分别达到1 174 V和774 V,耐击穿电压分别在1 050 V和660 V以上;外径25 μm、包覆层厚度3.2 μm的玻璃包覆纯铜微丝抗软化击穿温度大于400 ℃。

Abstract:

The glass-coated pure copper microwires were prepared by self-designed experimental equipment. The copper fiber diameter was 4-30 μm and the thickness of glass-coated layer was 2?8 μm. The anti-corrosion and electrical properties of the microwires were also evaluated. The results show that the resisting salt spray corrosion time of the microwires is above 240 h in neutral salt spray test; the average breakdown voltages of the microwires with 25 μm in outer diameter and 3.2 μm in thickness of glass-coated layer and with 18 μm in outer diameter and 2.3 μm in thickness of glass-coated layer are 1 174 V and 774 V, respectively; the anti-breakdown voltages are above 1 050 V and 660 V; the cut through temperature of the microwire with 25 μm in outer diameter and 3.2 μm in thickness of glass-coated layer is above 400 ℃.

基金信息:国家杰出青年科学基金资助项目

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