Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi/Cu lead-free solder joints
来源期刊：International Journal of Minerals Metallurgy and Materials2013年第9期
论文作者：Guo-qiang Wei Lei Wang Xin-qiang Peng Ming-yang Xue
文章页码：883 - 889
摘 要：The growth rule of the interfacial intermetallic compound（IMC） and the degradation of shear strength of Sn-0.8Ag-0.5Cu-2.0Bi-0.05Ni（SACBN）/Cu solder joints were investigated in comparison with Sn-3.0Ag-0.5Cu（SAC305）/ Cu solder joints aging at 373,403,and 438 K.The results show that（Cu1 x,Nix）6Sn5phase forms between the SACBN solder and Cu substrate during soldering.The interfacial IMC thickens constantly with the aging time increasing,and the higher the aging temperature,the faster the IMC layer grows.Compared with the SAC305/Cu couple,the SACBN/Cu couple exhibits a lower layer growth coefcient.The activation energies of IMC growth for SACBN/Cu and SAC305/Cu couples are 111.70 and 82.35 kJ/mol,respectively.In general,the shear strength of aged solder joints declines continuously.However,SACBN/Cu solder joints exhibit a better shear strength than SAC305/Cu solder joints.
Guo-qiang Wei，Lei Wang，Xin-qiang Peng，Ming-yang Xue
School of Mechanical and Automotive Engineering, South China University of Technology
摘 要：The growth rule of the interfacial intermetallic compound（IMC） and the degradation of shear strength of Sn-0.8Ag-0.5Cu-2.0Bi-0.05Ni（SACBN）/Cu solder joints were investigated in comparison with Sn-3.0Ag-0.5Cu（SAC305）/ Cu solder joints aging at 373,403,and 438 K.The results show that（Cu1 x,Nix）6Sn5phase forms between the SACBN solder and Cu substrate during soldering.The interfacial IMC thickens constantly with the aging time increasing,and the higher the aging temperature,the faster the IMC layer grows.Compared with the SAC305/Cu couple,the SACBN/Cu couple exhibits a lower layer growth coefcient.The activation energies of IMC growth for SACBN/Cu and SAC305/Cu couples are 111.70 and 82.35 kJ/mol,respectively.In general,the shear strength of aged solder joints declines continuously.However,SACBN/Cu solder joints exhibit a better shear strength than SAC305/Cu solder joints.
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