Voltage-induced material removal mechanism of copper for electrochemical-mechanical polishing applications

来源期刊:中国有色金属学报(英文版)2009年增刊第1期

论文作者:Sang-Jun HAN Yong-Jin SEO

文章页码:262 - 265

Key words:electrochemical mechanical polishing; linear sweep voltammetry; cyclic voltammetry; HNO3; KNO3; electrolyte

Abstract: The current—voltage (I—V) curves, such as linear sweep voltammetry (LSV) and cyclic voltammetry (CV), were employed to evaluate the effect of electrolyte concentration on the electrochemical reaction trend. From the I—V curve, the electrochemical states of active, passive, transient and trans-passive region could be characterized. And then, the mechanism of the process of voltage-induced material removal in electrochemical mechanical polishing (ECMP) of copper was investigated. Scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) analyses were used to observe the surface profile. Finally, the oxidation and reduction processes of the Cu surface were monitored by the repetition of anodic and cathodic potential from cyclic voltammetry (CV) method in acid- and alkali-based electrolyte.

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