Influence of Mechanical Behavior between the Grains on Stress Fluctuation of Aluminum Alloy Thick Plate
来源期刊：Journal Of Wuhan University Of Technology Materials Science Edition2013年第6期
论文作者：LIAO Kai WU Yunxin GONG Hai
文章页码：1212 - 1216
摘 要：The research on fluctuation and inhomogeneity of internal stress of aluminum alloy thick plate is theoretical and technological base for stress control technology. By using X-ray diffraction technique and mechanical test method, aluminum alloy with typical fine sub-grains, coarse recrystallized grains, and second phase was analyzed; the interactive mechanical model between grains was built for analysis of variation of internal stress within the local micro structure by imitating the actual distribution of grains. The experimental result shows that the mechanical model can effectively explain the reason for fluctuation of microscopic stress, which also proves that the inhomogeneous distribution of metal organization is the cause for the complex distribution of microscopic stress. The model can well describe stress distribution of thick plate caused by thermal deformation. Besides, it well describes mechanism of stress fluctuation.
LIAO Kai1,2，WU Yunxin3，GONG Hai3
1. School of Mechanical and Electrical Engineering,Central South University of Forestry and Technology2. Guilin University of Electrical Technology3. School of Mechanical and Electrical Engineering,Central South University
摘 要：The research on fluctuation and inhomogeneity of internal stress of aluminum alloy thick plate is theoretical and technological base for stress control technology. By using X-ray diffraction technique and mechanical test method, aluminum alloy with typical fine sub-grains, coarse recrystallized grains, and second phase was analyzed; the interactive mechanical model between grains was built for analysis of variation of internal stress within the local micro structure by imitating the actual distribution of grains. The experimental result shows that the mechanical model can effectively explain the reason for fluctuation of microscopic stress, which also proves that the inhomogeneous distribution of metal organization is the cause for the complex distribution of microscopic stress. The model can well describe stress distribution of thick plate caused by thermal deformation. Besides, it well describes mechanism of stress fluctuation.
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