Effect of Pd ions in the chemical etching solution

Guixiang Wang1,2), Ning Li1), and Deyu Li1) 1) Applied Chemistry Department, Harbin Institute of Technology, Harbin 150001, China 2) College of Material Science and Chemical Engineering, Harbin Engineering University, Harbin 150001, China

摘 要：The acrylonitrile-butadiene-styrene （ABS） surface was etched by dipping it into chromic acid-sulfuric acid containing a trace amount of palladium. The surface roughness, activity, and valence bond were characterized by atomic force microscopy （AFM） and X-ray photoelectron spectroscopy （XPS）. The results showed that with the increase of Pd concentration in the etching solution the ABS surface roughness reduced. The ratio of O to C increases and forms a large amount of O=C?O functional groups by dipping into Pd contained etching solution, thus the amount of colloids palladium adsorption increases. The carboxyl group acts as the ad- sorption site for the Pd/Sn catalyst.

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