Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe—Ni Solder Joints
来源期刊：JOURNAL OF MATERIALS SCIENCE TECHNOLOG2014年第9期
论文作者：Hao Zhang Qing-Sheng Zhu Zhi-Quan Liu
文章页码：928 - 933
摘 要：FeeNi films with compositions of Fee75Ni,Fee50Ni,and Fee30Ni were used as under bump metallization(UBM)to evaluate the interfacial reliability of SnAgCu/FeeNi solder joints through ball shear test,high temperature storage,and temperature cycling.The shear strengths for Fee75Ni,Fee50Ni,and Fee30Ni solder joints after reflow were 42.57,53.94 and 53.98 MPa,respectively,which were all satisfied the requirement of industrialization(>34.3 MPa).High temperature storage was conducted at 150,175 and200 C.It was found that higher Fe content in FeeNi layer had the ability to inhibit the mutual diffusion at interface region below 150 C,and the growth speed of intermetallic compound(IMC)decreased with increasing Fe concentration.When stored at 200 C,the IMC thickness reached a limit for all three films after4 days,and some cracks occurred at the interface between IMC and FeeNi layer.The activation energies for the growth of FeSn2on Fee30Ni,Fee50Ni,and Fee75Ni films were calculated as 246,185,and 81 kJ/mol,respectively.Temperature cycling tests revealed that SnAgCu/Fee50Ni solder joint had the lowest failure rate(less than 10%),and had the best interfacial reliability among three compositions.
Hao Zhang1，Qing-Sheng Zhu1，Zhi-Quan Liu1
1. Institute of Metal Research, Chinese Academy of Sciences
摘 要：FeeNi films with compositions of Fee75Ni,Fee50Ni,and Fee30Ni were used as under bump metallization(UBM)to evaluate the interfacial reliability of SnAgCu/FeeNi solder joints through ball shear test,high temperature storage,and temperature cycling.The shear strengths for Fee75Ni,Fee50Ni,and Fee30Ni solder joints after reflow were 42.57,53.94 and 53.98 MPa,respectively,which were all satisfied the requirement of industrialization(>34.3 MPa).High temperature storage was conducted at 150,175 and200 C.It was found that higher Fe content in FeeNi layer had the ability to inhibit the mutual diffusion at interface region below 150 C,and the growth speed of intermetallic compound(IMC)decreased with increasing Fe concentration.When stored at 200 C,the IMC thickness reached a limit for all three films after4 days,and some cracks occurred at the interface between IMC and FeeNi layer.The activation energies for the growth of FeSn2on Fee30Ni,Fee50Ni,and Fee75Ni films were calculated as 246,185,and 81 kJ/mol,respectively.Temperature cycling tests revealed that SnAgCu/Fee50Ni solder joint had the lowest failure rate(less than 10%),and had the best interfacial reliability among three compositions.
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