Diffusion bonding of Al alloy to Al2O3 ceramic
来源期刊：中国有色金属学报(英文版)2003年第z1期
论文作者：FENG Ji-cai(冯吉才) WANG Da-yong(王大勇) LI Zhuo-ran(李卓然) LIU Hui-jie(刘会杰)
文章页码：1 - 4
Key words：Al alloy; Al2O3 ceramic; diffusion bonding
Abstract: A layer of Cu was sintered on the surface of Al2O3 ceramic before bonding, and then diffusion bonding technology was applied to bond Al2O3/Cu to Al alloy. SEM and EDS were applied to analyze the interfacial microstructures of Al2O3/Cu/Al joint. The preliminary research shows that Al/Cu interfacial microstructures are the main factor affecting joint strength. With increasing bonding temperature and time, ((Al)+θ) mixture separates out from Al alloy, and (Cu)+ γ1）mixture separates out from Cu layer. The two kinds of mixtures develop first along interface, then (Cu)+γ1) microstructure turns progressively into (ξ2 +δ) with bonding temperature and time prolonged. At the same time, ((Al)+θ) and /(ξ2 +δ) phases move gradually into base materials. The two kinds of changes result in reducing bonding strength greatly. The optimum diffusion bonding parameters are determined as follows: T=773K, t=1226s and p=6MPa, at which the tensile strength of the joint is 108MPa, and the shear strength of the joint is 45MPa.
FENG Ji-cai(冯吉才), WANG Da-yong(王大勇), LI Zhuo-ran(李卓然), LIU Hui-jie(刘会杰)
(National Key Laboratory of Advanced Welding Production Technology,
Harbin Institute of Technology, Harbin 150001, China)
Abstract:A layer of Cu was sintered on the surface of Al2O3 ceramic before bonding, and then diffusion bonding technology was applied to bond Al2O3/Cu to Al alloy. SEM and EDS were applied to analyze the interfacial microstructures of Al2O3/Cu/Al joint. The preliminary research shows that Al/Cu interfacial microstructures are the main factor affecting joint strength. With increasing bonding temperature and time, ((Al)+θ) mixture separates out from Al alloy, and (Cu)+ γ1）mixture separates out from Cu layer. The two kinds of mixtures develop first along interface, then (Cu)+γ1) microstructure turns progressively into (ξ2 +δ) with bonding temperature and time prolonged. At the same time, ((Al)+θ) and /(ξ2 +δ) phases move gradually into base materials. The two kinds of changes result in reducing bonding strength greatly. The optimum diffusion bonding parameters are determined as follows: T=773K, t=1226s and p=6MPa, at which the tensile strength of the joint is 108MPa, and the shear strength of the joint is 45MPa.
Key words:Al alloy; Al2O3 ceramic; diffusion bonding
