Thermal and Mechanical Properties of Epoxy Resin Modified with N-（4-hydroxyphenyl）terahydrophthalic Anhydrideimide
来源期刊：Journal Of Wuhan University Of Technology Materials Science Edition2018年第3期
论文作者：徐任信 CHENG Shixin ZHOU Jing SHEN Jie LI Zheng TAN Xing
文章页码：744 - 748
摘 要：A novel epoxy-imide resin based on diglycidyl ether of bisphenol-A and N-（4-hydroxyphenyl）terahydrophthalic anhydrideimide（HTAM） was synthesized. The structural characterization of the epoxy-imide resin was conducted by FT-IR spectra. 4,4’-diaminodiphneylmethane（DDM） was used as a curing agent for the epoxy-imide resin. The thermal properties of the cured resin were evaluated with dynamic mechanical analyses（DMA） and thermogravimetric analysis（TGA）. The results showed that the cured resin exhibited a high glass transition temperature（Tg） of 186 ℃ when the molar amount of HTAM was 0.04 mol in the resin. The yields of the cured resin at 800 ℃ raised from 16.45% to 19.41%. The flexural properties were also measured, the flexural strength raised from 79.4 to 95.7 MPa, and the flexural modulus exhibited from 2.6 to 3.0 GPa.
徐任信，CHENG Shixin，ZHOU Jing，SHEN Jie，LI Zheng，TAN Xing
School of Materials Science & Engineering, Wuhan University of Technology
摘 要：A novel epoxy-imide resin based on diglycidyl ether of bisphenol-A and N-（4-hydroxyphenyl）terahydrophthalic anhydrideimide（HTAM） was synthesized. The structural characterization of the epoxy-imide resin was conducted by FT-IR spectra. 4,4’-diaminodiphneylmethane（DDM） was used as a curing agent for the epoxy-imide resin. The thermal properties of the cured resin were evaluated with dynamic mechanical analyses（DMA） and thermogravimetric analysis（TGA）. The results showed that the cured resin exhibited a high glass transition temperature（Tg） of 186 ℃ when the molar amount of HTAM was 0.04 mol in the resin. The yields of the cured resin at 800 ℃ raised from 16.45% to 19.41%. The flexural properties were also measured, the flexural strength raised from 79.4 to 95.7 MPa, and the flexural modulus exhibited from 2.6 to 3.0 GPa.
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