Influence of copper on quality of hot strips by EAF-CSP process

Yuanli Wang, Delu Liu, Weiran Shao, Jie Fu, Yonglin Kang, Deguang Zhou, and Zhongbing Wang1) Materials Science and Engineering School, University of Science and Technology Beijing, Beijing 100083, China2) Metallurgical Engineering School, University of Science and Technology Beijing, Beijing 100083, China3) Guanzhou Zhujiang Iron and Steel Co. Ltd., Guangzhou 510620, China

摘 要：<正> Electron microscopy and X-ray Energy Dispersive Spectroscopy （XEDS） study on influence of Cu on low carbon hot strips produced by CSP （Compact Strip Production） process has been carried out. The results indicated that copper segregation and enrichment at interfacial layer between oxidized surface and steel matrix is the key factor, which results in microcracks and edge flaws on the strips. The primary considerations to prevent detrimental effects from Cu include controlling copper content in proper level, higher soaking temperature and non-oxidizable atmosphere during soaking. Copper sulfide precipitates with nanometers in size were observed, they may be beneficial to the properties of CSP products, and influence of Cu on quality of CSP hot strips is discussed.

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