Microstructure and texture of electroformed copper liners of shaped charges

Wenhuai Tian1), Hongye Gao1), Ailing Fan1), Xiaoou Shan1), and Qi Sun2)1) Materials Science and Engineering School, University of Science and Technology Beijing, Beijing 100083, China2) Beijing 210 Institute, Beijing 100081, China

摘 要：<正>The microstructures of copper liners of shaped charges prepared by electroforming technique were investigated by transmission electron microscopy （TEM）. Meanwhile, the orientations distributing of the grains in the electroformed copper liners of shaped charges was examined by the electron backscattering Kikuchi pattern （EBSP） technique. TEM observations have revealed that these electroformed copper liners of shaped charges have the grain size of about 1-3 um and the grains have a preferential orientation distribution along the growth direction. EBSP analysis has demonstrated that the as-formed copper liners of shaped charges exhibit a micro-texture, i.e. one type of fiber texture, and the preferred growth direction is normal to the surface of the liners.

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