电感耦合等离子体原子发射光谱法测定Sn-Ag-Cu系焊锡中铅和镉

来源期刊：冶金分析2011年第5期

论文作者：雷宏田 王静 毛亚蓉

文章页码：71 - 73

关键词：电感耦合等离子体原子发射光谱法； 焊锡； 铅； 镉

Key words：inductively coupled plasma atomic emission spectrometry； solder； lead； cadmium

摘    要：样品用盐酸、过氧化氢溶解,在少量硫酸存在下,以盐酸和氢溴酸挥锡,电感耦合等离子体原子发射光谱法测定铅和镉的含量。优化了仪器的工作参数,对溶样酸和锡基体等影响因素进行了试验。本法测铅和镉的线性范围分别为0.50～5.00μg/mL和0.050～0.50μg/mL,检出限分别为13.2μg/L和0.9μg/L,样品测定结果的相对标准偏差(n=6)均小于4%,用标准加入法测得回收率分别为97%～108%和90%～96%。

Abstract: The solder samples were dissolved in hydrochloric acid and hydrogen peroxide.Then,the tin was removed by hydrochloric acid-hydrobromide in presence of little sulfuric acid,and the contents of lead and cadmium were determined by inductively coupled plasma atomic emission spectrometry(ICP-AES).The working parameters of ICP instrument were optimized.The influencing factors such as acid for dissolving sample and tin matrix were tested.The linear ranges in this method were obtained between 0.50-5.00 μg/mL(for Pb) and 0.050-0.50 μg/mL(for Cd).The detection limits were 13.2 μg/L for Pb and 0.9 μg/L for Cd,respectively.The relative standard deviations(RSD,n=6) were less than 4%.The recoveries rate for lead and cadmium obtained by standard addition method were 97%-108% and 90%-96% respectively.