PLASTIC DEFORMATION BEHAVIOR OF ELECTROFORMED COPPER LINER OF SHAPED CHARGE AT DIFFERENT STRAIN RATES
来源期刊：Acta Metallurgica Sinica2003年第1期
论文作者：H.Y.Gao A.L.Fan Q.Sun W.H.Tian
Key words：electroformation; electron backscattering Kikuchi pattern; cellu-lar dislocation structure; ultra-high-strain-rate deformation; dy-namic recovery and recrystallization;
Abstract: The paper deals with different plastic deformation behavior of electroformed copperliner of shaped charge, deformed at high strain rate (about 1×107 s-1) and normalstrain rate (4×10-4 s-1). The crystallographic orientation distribution of grains inrecovered slugs which had undergone high-strain-rate plastic deformation during ex-plosive detonation was investigated by electron backscattering Kikuchi pattern tech-nique. Cellular structures formed by tangled dislocations and sub-grain boundariesconsisting of dislocation arrays were detected in the recovered slugs. Some twins andslip dislocations were observed in specimen deformed at normal strain rate. It wasfound that dynamic recovery and recrystallization take place during high-strain-ratedeformation due to the temperature rising, whereas the conventional slip mechanismoperates during deformation at normal strain rate.
H.Y.Gao1，A.L.Fan1，Q.Sun2，W.H.Tian1
(1.Department of Materials Physics and Chemistry, University of Science and Technology Beijing, Beijing 100083, China;
2.210 Institute, Beijing 100081, China)
Abstract:The paper deals with different plastic deformation behavior of electroformed copperliner of shaped charge, deformed at high strain rate (about 1×107 s-1) and normalstrain rate (4×10-4 s-1). The crystallographic orientation distribution of grains inrecovered slugs which had undergone high-strain-rate plastic deformation during ex-plosive detonation was investigated by electron backscattering Kikuchi pattern tech-nique. Cellular structures formed by tangled dislocations and sub-grain boundariesconsisting of dislocation arrays were detected in the recovered slugs. Some twins andslip dislocations were observed in specimen deformed at normal strain rate. It wasfound that dynamic recovery and recrystallization take place during high-strain-ratedeformation due to the temperature rising, whereas the conventional slip mechanismoperates during deformation at normal strain rate.
Key words:electroformation; electron backscattering Kikuchi pattern; cellu-lar dislocation structure; ultra-high-strain-rate deformation; dy-namic recovery and recrystallization;
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