Solid state interfacial reactions in electrodeposited Ni/Sn couples
来源期刊：International Journal of Minerals Metallurgy and Materials2010年第4期
论文作者：Douglas-G.Ivey
文章页码：459 - 463
摘 要：<正>Ni/Sn couples,prepared by sequentially electroplating Ni layers and Sn layers on metallized Si wafers,were employed to study the mierostructures and growth kinetics of Ni-Sn intermediate phases,when the Ni/Sn couples were aged at room temperature or annealed at temperatures from 150 to 225℃for various times.The results show that the NiSn phase and Ni3Sn4 phase are formed,respectively,in the aged couples and annealed couples.The Ni3Sn4 layer is continuously distributed between the Ni and Sn sides in the annealed Ni/Sn couples. The Ni3Sn4 growth follows parabolic growth kinetics with an apparent activation energy of 39.0 kJ/mol.
Douglas-G.Ivey
Department of Chemical and Materials Engineering University of Alberta,Edmonton T6G 2G6,Canada
摘 要：<正>Ni/Sn couples,prepared by sequentially electroplating Ni layers and Sn layers on metallized Si wafers,were employed to study the mierostructures and growth kinetics of Ni-Sn intermediate phases,when the Ni/Sn couples were aged at room temperature or annealed at temperatures from 150 to 225℃for various times.The results show that the NiSn phase and Ni3Sn4 phase are formed,respectively,in the aged couples and annealed couples.The Ni3Sn4 layer is continuously distributed between the Ni and Sn sides in the annealed Ni/Sn couples. The Ni3Sn4 growth follows parabolic growth kinetics with an apparent activation energy of 39.0 kJ/mol.
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