静电键合用微晶玻璃的研究

来源期刊：中南大学学报(自然科学版)2003年第5期

论文作者：常鹰 卢安贤

文章页码：472 - 475

关键词：Li₂O-Al₂O₃-SiO₂系统;微晶玻璃;静电键合

Key words：Li₂O-Al₂O₃-SiO₂ system; glass-ceramics; anodic bonding

摘    要：采用传统熔体冷却方法,研究以TiO₂为成核剂、以Li₂O-Al₂O₃-SiO₂为基础组成的玻璃的制备工艺;根据差热分析(DTA)的结果确定玻璃的核化与晶化温度,然后针对基础玻璃组成,采用二步热处理方法获得透明的微晶玻璃;用X射线衍射分析(XRD)和扫描电子显微镜(SEM)对晶化试样的物相和显微结构进行研究;用热膨胀仪测定玻璃在热处理前、后的热膨胀系数;用绝缘电阻测试仪测试该微晶玻璃的电阻率.研究结果表明:微晶玻璃的主晶相为Al₂O₃·TiO₂微晶体,次晶相为ZnSiO₃;微晶玻璃与硅片有相近的热膨胀系数,约为32.5×10^-7/℃;微晶玻璃晶化后的电阻率较低,为6.8×10¹⁰Ω·cm.

Abstract: The basic glasses of the Li₂O-Al₂O₃-SiO₂ system with TiO₂ as nucleation agent were prepared by adopting conventional melt quenching technology, and the temperature of nucleation and crystallization were determined based on results of DTA. Transparent glass-ceramics were obtained by using two-step heat-treatment method with the Li₂O-Al₂O₃-SiO₂ system, which contains main crystal phases Al₂O₃·TiO₂ and minor crystal phases ZnSiO3.The crystalline phases, the microstructures of the glass-ceramics were investigated by means of the XRD and SEM. The thermal expansion coefficients of the glass before and after it is heat-treated were determined, and the resistivity of glass-ceramics was measured by NF2511A. The results show that the thermal ex- pansion coefficient of the glass-ceramics clos upon that of silicon is about 32.5×10^-7/℃, and resistivity of the glass-ceramics is 6.8×10¹⁰Ω·cm.