Fabrication and characterization of Ag flake hybrid circuits with IPL-sintering
来源期刊：JOURNAL OF MATERIALS SCIENCE TECHNOLOG2020年第18期
论文作者：Choong-Jae Lee Kwang-Ho Jung Kyung Deuk Min Bum-Geun Park Seung-Boo Jung
文章页码：13 - 18
摘 要：The study of photonic sintering has gained interest based on the advantages of fast processing at room temperature. However, printed electronics made from photonic sintering with an intensive pulsed light（IPL） energy source exhibit more mechanical instability than those made from conventional thermal sintering processes. To solve the mechanical instability problems, we fabricated Ag flake hybrid pastes with a variety of concentrations of Ag flake（0, 25, 50, 75, and 100 wt.%）. All of the screen-printed hybrid Ag circuits were fabricated on polyimide substrates and were sintered at 3.5 MW. Surface porosity was analyzed using the Brunauer-Emmett-Teller method. An IPC（Packaging Electronic Circuits） sliding test was performed to analyze the flexibility of the screen-printed Ag flake hybrid circuits. The adhesion strength of the hybrid circuits was evaluated with a roll-type 90° peel test. The hybrid Ag printed circuit showed improvements in both the flexibility and adhesion strength with the addition of Ag flake.
Choong-Jae Lee1，Kwang-Ho Jung1，Kyung Deuk Min1，Bum-Geun Park2，Seung-Boo Jung1
1. School of Advanced Materials Science & Engineering, Sungkyunkwan University2. Visual Display Business, Samsung Electronics Co., Ltd.
摘 要：The study of photonic sintering has gained interest based on the advantages of fast processing at room temperature. However, printed electronics made from photonic sintering with an intensive pulsed light（IPL） energy source exhibit more mechanical instability than those made from conventional thermal sintering processes. To solve the mechanical instability problems, we fabricated Ag flake hybrid pastes with a variety of concentrations of Ag flake（0, 25, 50, 75, and 100 wt.%）. All of the screen-printed hybrid Ag circuits were fabricated on polyimide substrates and were sintered at 3.5 MW. Surface porosity was analyzed using the Brunauer-Emmett-Teller method. An IPC（Packaging Electronic Circuits） sliding test was performed to analyze the flexibility of the screen-printed Ag flake hybrid circuits. The adhesion strength of the hybrid circuits was evaluated with a roll-type 90° peel test. The hybrid Ag printed circuit showed improvements in both the flexibility and adhesion strength with the addition of Ag flake.
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