同时考虑界面非等温特性和对流影响的二元合金自由枝晶生长模型

来源期刊:中国有色金属学报(英文版)2021年第5期

论文作者:刘书诚 刘礼华 李述 王金忠

文章页码:1518 - 1528

关键词:建模;枝晶凝固;二元合金;非等温界面;对流

Key words:modeling; dendritic solidification; binary alloys; nonisothermal interface; convection

摘    要:在同时考虑界面非等温性质以及强制对流影响的情况下,提出二元合金的扩展自由枝晶生长模型。模型对比表明:由于溶质扩散系数通常比热扩散系数小3个数量级,当低过冷时,对流对溶质扩散的影响比其对热扩散的影响更强烈。当高过冷时,对流对枝晶生长的影响很小。此外,本模型能够对现有Cu70Ni30合金实验数据给出一致的描述,特别是在低过冷时。这得益于当前模型获得了比忽略对流影响的模型更快的界面迁移速率。

Abstract: Considering both the effect of the nonisothermal nature of the interface as well as the effect of forced convection, an extended free dendritic growth model for binary alloys was proposed. Comparative analysis indicates that the effect of convection on solute diffusion is more remarkable compared with the ignorable effect of convection on thermal diffusion at low bath undercooling, due to the fact that solute diffusion coefficient is usually three orders of magnitude less than thermal diffusion coefficient. At high bath undercooling, the effect of convection on the dendritic growth is very slight. Furthermore, a satisfying agreement between the model predictions with the available experiment data for the Cu70Ni30 alloy was obtained, especially at low bath undercoolings, profiting from the higher values of interfacial migration velocity predicted by the present model with nonideal fluid case than that predicted by the one ignoring the effect of convection.

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