热处理温度对电刷镀Ni-P镀层组织的影响

来源期刊：金属学报2010年第7期

论文作者：李志明 钱士强 王伟 刘继华

文章页码：867 - 872

关键词：Ni-P镀层； 电刷镀； 热处理； 组织

Key words：Ni-P coatings； electro-brush plating； heat-treatment； structure

摘    要：利用XRD研究了电刷镀Ni-P镀层经不同温度热处理后的组织结构.研究表明,镀态电刷镀Ni-P镀层呈非晶态;热处理温度在350℃以上时,Ni,Ni3P形核生长;热处理温度在500℃以上时,镀层中有NiO生成.镀层的结晶度与热处理温度呈典型的"S"形关系变化,晶化激活能为(237.9±10.46)kJ·mol^-1.随热处理温度升高,Ni的晶格常数先增大后减小;而Ni₃P的晶格常数a随热处理温度上升而变小,而c略微增大;Ni和Ni₃P晶粒大小随热处理温度的上升均增大;Ni和Ni₃P晶体长大的表观活化能分别为(66.85±3.15)kJ·mol^-1和(133.41±4.69)kJ·mol^-1,前者仅为后者的50%,表明在热处理过程中Ni晶体有优先长大的趋势.

Abstract: The effects of heat-treat temperature on the structural of electro-brush plating Ni-P coatings were investigated using X-ray diffraction (XRD) analysis.The results show that the eletrobrush plating Ni-P coating is mainly in amorphous state.When heat-treat temperature above 350℃, Ni and Ni₃P crystal appear,NiO is generated as the heat-treat temperature is above 500℃.There is a typical S-shaped relationship between the crystallinity and heat-treat temperature.The activation energy of crystallization is (237.9±10.46)kJ·mol^-1.As the heat-treat temperature rises,Ni crystal cell parameter a increases firstly and then decreases,Ni₃P crystal cell parameter a decreases but c has a little increase.The crystal size of both Ni and M₃P has some increase with the rise of heat-treat temperature.The activation energies for the growth of Ni and Ni₃P are (66.85±3.15)kJ·mol^-1 and (133.41±4.69)kJ·mol^-1,respectively,and the great disparity imply that Ni crystal has dynamic for preferred growth.