弥散强化铜致密化研究

来源期刊：中南大学学报(自然科学版)1983年第4期

论文作者：张吟秋 李美英 雷长明

文章页码：37 - 42

关键词：弥散强化铜； 烧结致密化； 烧结温度； 相对密度； 致密化过程； 烧结过程； 颗粒边界； 粉末冶金工艺； 包套挤压； 成品率

摘    要：本文对Cu-0.86V%Al₂O₃弥散强化钢(DSCu)粉末坯进行了四种致密化方法的研究和比较。讨论和观察了致密化过程中温度、压力的功能和形貌变化。认为:(1)DSCu粉末坯锭致密化应包括坯块密度的提高和颗粒结合状态的改变;(2)DSCu宜采用有应力烧结。采用致密化坯锭挤压。可使DSCu材料成品率提高20%以上。

Abstract: The present paper deals with and compares four densification proce- sses of dispersion strengthened copper containing 0.86 V% alumina. The variety of photomicrograph was observed and the influence of operation temperature and pressure was discussed. It was considered that the densi- fication process of dispersion strengthened copper should consist of in- creasing relative density of compact and changing interparticle state, and that dispersion strengthened copper should be sintered under stress. By extruding densified compact, the percentage of qualified products can be increased more than 20%.