Interfacial reactions and diffusion path in partial transient liquid-phase bonding of Si₃N₄/Ti/Ni/Ti/Si₃N₄

来源期刊：中国有色金属学报(英文版)1999年第4期

论文作者：陈铮 赵其章 方芳 楼宏青 睦润舟 李志章

文章页码：831 - 837

Key words：ceramic joining; transient liquid-phase bonding; interfacial reactions; diffusion

Abstract: The interfacial reactions in partial transient liquid-phase bonding of Si₃N₄ ceramics with Ti/Ni/Ti interlayers were studied by means of scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and X-ray diffractometry (XRD). It was shown that the interfacial structure of Si₃N₄/TiN/Ti₅Si₃+Ti₅Si₄ + Ni₃Si/ (NiTi ) /Ni₃Ti/ Ni was formed after bonding. The activation energies for TiN layer and the mixed reaction layer of Ti₅Si₃ + Ti₅Si₄ + Ni₃Si are 546. 8 kJ/mol and 543. 9 kJ/mol, respectively. The formation and transition processes of interface layer sequence in the joint were clarified by diffusion path. An important characteristic, which is different from the conventional brazing and soid-state diffusion bonding, has been found, i. e., during the partial transient liquid-phase bonding, not only the reaction layers which have formed grow, but also the diffusion path in the subsequent reaction changes because of the remarkable variation of the concentration on the metal side.