Capillary wave formation on excited solder jet and fabrication of lead-free solder ball

来源期刊:中国有色金属学报(英文版)2005年第5期

论文作者:张曙光 何礼君 朱学新 张少明 石力开 徐骏

文章页码:997 - 1002

Key words:jet; breakup; capillary wave; disturbance; solder ball

Abstract: A survey of solder ball production processes especially focusing on disturbed molten metal jet breakup process was made. Then the formation of capillary wave on tin melt jet in the way of rapid solidification was studied. A semi-empirical formula, which can be written as λ=Cvib(σ/ρ)1/3f-2/3 to predict the relationship between wavelength of capillary wave and frequency of imposed vibration was obtained. Sn-4.0Ag-0.5Cu lead free solder ball was successfully produced with tight distribution and good sphericity. The excited jet breakup process is promising for cost effectively producing solder ball.

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