Application of Electroless Fe-42Ni（P） Film for Under-bump Metallization on Solder Joint
来源期刊：JOURNAL OF MATERIALS SCIENCE TECHNOLOG2013年第1期
论文作者：Haifei Zhou Jingdong Guo Qingsheng Zhu Jianku Shang
文章页码：7 - 12
摘 要：Because Fe has a more negative standard reduction potential than Ni, the simultaneous electroless deposition of Fe and Ni is difficult. In this study, Fe-42Ni（P） electroless deposit was prepared by using disodium ethylene diamine tetraacetate （ETDA-2Na） as complexing agent to reduce the difference in the electrode potential between Ni2+ and Fe2+ . The solderability and the interfacial reaction between Fe-42Ni（P） alloy and Sn were investigated. It was found that the electroless Fe-42Ni（P） alloy has excellent wettability with Sn. Moreover, the interfacial reaction rate between Fe-42Ni（P） and Sn is very slow. These results suggest that Fe-42Ni（P） alloy may become an attractive under-bump metallization （UBM）.
Haifei Zhou1，Jingdong Guo1，Qingsheng Zhu1，Jianku Shang1,2
1. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences2. Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign
摘 要：Because Fe has a more negative standard reduction potential than Ni, the simultaneous electroless deposition of Fe and Ni is difficult. In this study, Fe-42Ni（P） electroless deposit was prepared by using disodium ethylene diamine tetraacetate （ETDA-2Na） as complexing agent to reduce the difference in the electrode potential between Ni2+ and Fe2+ . The solderability and the interfacial reaction between Fe-42Ni（P） alloy and Sn were investigated. It was found that the electroless Fe-42Ni（P） alloy has excellent wettability with Sn. Moreover, the interfacial reaction rate between Fe-42Ni（P） and Sn is very slow. These results suggest that Fe-42Ni（P） alloy may become an attractive under-bump metallization （UBM）.
关键词：
