Design and performance test of miniature capillary pumped loop for electronics cooling

来源期刊：中南大学学报(英文版)2008年第z2期

论文作者：万珍平 皮丕辉 付永清 汤勇

文章页码：235 - 239

Key words：electronic components； miniature capillary pumped loop； heat dissipation； intensified boiling； condensation

Abstract: Considering two characteristics of compact heat dissipation room and high heat flux, a novel miniature capillary pumped loop (MCPL) for electronics cooling was proposed. MCPL consists of evaporator, condenser, vapor and liquid line dissipates heat by boiling and condensation of working fluids with no extra power consumption. Working fluid circulation is ensured by vapor pressure and capillary head. Saturated wick screens vapor and liquid, and ensures one-way flow of working fluid with no extra valve. In order to promote heat dissipation capacity of MCPL, the intensified boiling and condensation structures are embedded into evaporator and condenser respectively, which are useful to increasing boiling and condensation efficiency. Startup and run characteristics are tested by experiments in the condition of different power inputs and working fluids. MCPL is capable of dissipating 80 W of thermal energy and keeping the bottom substrate temperature of evaporator at 80 ℃.