Effects of Silicon Nanoparticles on the Transient Liquid Phase Bonding of 304 Stainless Steel
来源期刊：JOURNAL OF MATERIALS SCIENCE TECHNOLOG2014年第3期
论文作者：H.M.Hdz-García A.I.Martinez R.Mu?oz-Arroyo J.L.Acevedo-Dávila F.García-Vázquez F.A.Reyes-Valdes
文章页码：259 - 262
摘 要：Transient liquid phase（TLP） bonding of 304 stainless steel with nickel based filler metal, BNi-9, was performed to study the influence of silicon nanoparticles（NPs） on the mechanical and structural properties of the bonding area.It was found that silicon NPs act as a melting point depressant in the brazing process; the formation of silicon TLP induces the dissolution of elements of the metal filler and promotes a uniform distribution in the bonding area.Silicon NPs induce the development of smaller eutectic structures in the melting zone; it has been related to microhardness measurements, which are lower when the silicon NPs are used in the brazing process.
H.M.Hdz-García1，A.I.Martinez2，R.Mu?oz-Arroyo1，J.L.Acevedo-Dávila1，F.García-Vázquez1，F.A.Reyes-Valdes1
摘 要：Transient liquid phase（TLP） bonding of 304 stainless steel with nickel based filler metal, BNi-9, was performed to study the influence of silicon nanoparticles（NPs） on the mechanical and structural properties of the bonding area.It was found that silicon NPs act as a melting point depressant in the brazing process; the formation of silicon TLP induces the dissolution of elements of the metal filler and promotes a uniform distribution in the bonding area.Silicon NPs induce the development of smaller eutectic structures in the melting zone; it has been related to microhardness measurements, which are lower when the silicon NPs are used in the brazing process.
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