Diffusion Bonding of Ti-6Al-4V to QAl 10-3-1.5 with Ni/Cu Interlayers

Wei GUO, Xihua ZHAO, Minxia SONG, Jicai FENG and Biao YANG Key Laboratory of Automobile Materials (Jilin University), Ministry of Education, Department of Materials Science and Engineering, Jilin University, Changchun 130025, China National Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China

摘 要：<正>Ti-6Al-4V and QAl 10-3-1.5 diffusion bonding has been carried out with Ni/Cu interlayers. The diffusion-bonded joints are evaluated by scanning electron microscopy （SEM）, energy dispersive spectroscopy （EDS） and microhardness test. Intermetallic compounds at the interface zone are detected by X-ray diffraction （XRD）. Interfacial microstructure of TiNi+CuTis+α-Ti forms at the Ni/Ti-6Al-4V transition zone and Cu （ss. Ni） solid solution forms between Ni/Cu interlayers. The thickness of reaction layer （TiNi） increases with bonding time by a parabolic law: y2=K0exp（-150000/RT）t, and K0=2.9×10⁷ m2/s is figured out from the experiment data.

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