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during reflow soldering[J]. The Chinese Journal of Nonferrous Metals, 2007, 17(3): 410-416. [16] 孙晓梅. 微焊点的几何尺寸与界面元素扩散行为的研究[D]. 哈尔滨: 哈尔滨理工大学, 2012: 20-35. SUN Xiao-mei. Study on geometrical size of micro......
widely employed in the industrial casting, soldering, and welding processes [18,19]. Despite the advantages of using aluminum and aluminum alloys in industrial applications, they also have problems......
on Electronics Packaging Manufacturing, 2006, 29(4): 239-245. [49] 马 鑫. 电子组装中的无铅软钎焊技术[M]. 哈尔滨:哈尔滨工业大学出版社, 2006: 207-208.MA Xin. Lead-free soldering technology in electronic packaging[M]. Haerbing: Haerbing......
soldering and annealing [J]. Materials Science and Engineering A, 2006, 420: 39-46. [47] Ghosh G. Interfacial microstructure and the kinetics of interfacial reaction in diffusive couples between Sn-Pb......
in a dental gold alloy for soldering [J]. Journal of Alloys and Compounds, 1997, 261(1): 308-312. [42] LEE Jae-ho, YI Sang-joon, SEOL Hyo-joung, KWON Yong-hoon, LEE Jai-bong, KIM Hyung-il. Age-hardening......
and alloys. These alloys include iron and steel alloys [14-17], Al alloys [18,19], Ti alloys [20], Zr alloys [21,22] and soldering materials [23,24]. The reported results of these studies confirmed......
技术的应用市场和产业化规模. REFERENCES [1] 张启运, 庄鸿寿. 钎焊手册[M]. 北京: 机械工业出版社, 2018: 449-451. ZHANG Qi-yun, ZHUANG Hong-shou. Handbook of brazing and soldering[M]. Beijing: China Machine Press, 2018: 449-451. [2......
. [10] VARVENNE C, LEYON G P M, GHAZISAEIDI M, CURTIN W A. Solute strengthening in random alloys [J]. Acta Materialia, 2017, 124: 660-683. [11] TSAO L C, CHANG S Y, YU Y C. Direct active soldering......
and Engineering A, 2006, 422(1/2): 333-338. [19] 张启运, 庄鸿寿. 钎焊手册[M]. 北京: 机械工业出版社, 2008. ZHANG Qi-yun, ZHUANG Hong-shou. Brazing and soldering manual[M]. Beijing: China Machine Press, 2008. [20] 潘春旭, DUSAN P......