Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys

来源期刊：中国有色金属学报(英文版)2007年第4期

论文作者：赵小艳 赵麦群 崔小清 许天旱 仝明信

文章页码：805 - 805

Key words：Sn-Ag-Cu system; lead-free solder alloy; melting point; spreading property; mechanical property

Abstract: The melting point, spreading property, mechanical properties and microstructures of Sn-3.0Ag-2.8Cu solder alloys added with micro-variable-Ce were studied by means of optical microscopy, scanning electron microscopy(SEM) and energy dispersive X-ray(EDX). The results indicate that the melting point of Sn-3.0Ag-2.8Cu solder is enhanced by Ce addition; a small amount of Ce will remarkably prolong the creep-rupture life of Sn-3.0Ag-2.8Cu solder joint at room temperature, especially when the content of Ce is 0.1%, the creep-rupture life will be 9 times or more than that of the solder joint without Ce addition; the elongation of Sn-3.0Ag-2.8Cu solder is also obviously improved even up to 15.7%. In sum, the optimum content of Ce is within 0.05%-0.1 %.

基金信息：the National Basic Research Priorities Program of Shanxi Province
the Industry Project of Shanxi Province Education, China